Infineon Technologies (Korea CEO Lee Seung-soo) is accelerating advanced payment services through the launch of contactless payment solutions based on 28nm technology.

Infineon announced on the 29th that it is adding 28nm technology to its SECORA™ Pay solution portfolio.

The new product family is the industry's first product line using state-of-the-art 28nm chip technology with embedded non-volatile memory, aimed at alleviating the difficulties the payment industry is experiencing due to semiconductor supply shortages in legacy technology nodes.

Tolgahan Yildiz, head of payment solutions at Infineon's Connected Secure Systems division, stated, "Over the past few years, contactless payment experiences using dual-interface payment cards have become the global standard, and this trend has been accelerated particularly by the COVID-19 pandemic. The SECORA Pay solution portfolio is customized to enable the manufacturing and issuance of high-quality dual-interface payment cards, delivering the best transaction performance and reliable security."

The global dual-interface payment card market is expected to grow from approximately 2.6 billion units in 2022 to 2027 at a CAGR of 6 percent.

Infineon's new plug-and-play solution provides a simple onboarding and migration path for card manufacturers.

The solution is backward compatible with the existing SECORA Pay product family in terms of card production, antenna design, personalization, and product authentication.

Additionally, the device delivers industry-leading contactless and personalization performance, enabling contactless transactions within 155ms.

This product family uses a security controller with certified software integrated into a Coil on Module (CoM) chip module, and through the use of standardized inlays, card manufacturing is made simple and fast, with compatibility between SECORA Pay products adopting 65nm, 40nm, and 28nm technology.

Therefore, a single inlay sheet can be used for both previously released products and the new generation of SECORA Pay products.

The CoM system provides maximum flexibility in card design because Infineon uses inductive coupling technology together with copper wire card antennas.

Therefore, it is suitable for future market trends such as environmentally friendly cards made from recycled and marine plastic or wood, and high-performance dual-interface metal or LED cards.

Moreover, the SECORA Pay solution supports maximum throughput with minimal resources during card manufacturing for very robust dual-interface card production.

This makes the contactless payment technology itself resource-efficient. New value-added services based on the NFC tag functionality of SECORA Pay enable initial card activation and additional use cases such as online banking or loyalty program authentication.

Product versions supporting the latest Visa and Mastercard applications with very long validity periods are currently being supplied. Certified applets for American Express and Discover are planned to be provided within this year.