Microchip Technology Inc. (Nasdaq: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a new solution for protecting high-voltage circuits in battery electric vehicles (BEVs) and hybrid electric vehicles (HEVs).

Microchip Technology Inc. (NASDAQ: MCHP) today announced the launch of its silicon carbide (SiC)-based E-Fuse Demonstration Board, providing BEV and HEV developers with a more reliable and faster high-voltage circuit protection solution.

The new solution consists of six types suitable for use in battery systems from 400 to 800 V and provides rated currents up to 30 A.

High-voltage electric auxiliary systems installed in pure electric and hybrid electric vehicles require mechanisms to protect the system from load by preventing the flow of high voltage when an overload occurs.

The new E-Fuse demo solution is designed with high-voltage solid-state relays that can detect and interrupt fault currents in microseconds, 100 to 500 times faster than conventional mechanical relays. This fast response reduces peak short-circuit currents from tens of kiloamperes to hundreds of amps in the event of an overload, preventing system failures from leading to vehicle failure.

“Based on our silicon carbide technology, this E-Fuse demonstration solution provides OEM developers of electric vehicles (BEVs) and hybrid electric vehicles (HEVs) with a faster and more reliable development process for protecting their power electronics,” said Clayton Pillion, vice president of Microchip’s Silicon Carbide business unit. “The E-Fuse solution’s solid-state design eliminates performance degradation due to mechanical shock, arcing or contact rebound, thereby addressing long-term reliability issues associated with traditional electromechanical devices.”

The E-Fuse demo solution is designed to be resettable, allowing developers to easily integrate the E-Fuse solution into vehicles without the design burden of post-failure serviceability, a common design consideration. This reduces design complexity while enabling flexible vehicle packaging, potentially improving BEV/HEV power system distribution.

Additionally, the Local Interconnect Network (LIN) communication interface included in the E-Fuse demo board enables BEV/HEV OEM developers to accelerate the development of SiC-based auxiliary applications. The LIN interface allows configuration of overcurrent trip characteristics and diagnostic status checks without the need for additional hardware component modifications.

Microchip's E-Fuse demonstration solution works with Microchip's SiC MOSFET technology and the Core Independent Peripherals (CIPs) of PIC® microcontrollers with a LIN-based interface, delivering unparalleled performance and robustness. The companion components used in the E-Fuse demonstration solution are automotive qualified, enabling greater reliability with fewer components than discrete designs.

Microchip's SiC power solutions offer the industry's most flexible and comprehensive portfolio, comprising MOSFETs, diodes, and gate drivers in bare die, discrete, module, and custom power module configurations. For more information about Microchip's SiC semiconductors, visit our website.