"Packaging is not a single major field. Semiconductor packaging contains everything—electronics, mechanics, materials, and chemistry all mixed together," said Kang Sa-yun, chairman of the Korean Microelectronics and Packaging Society, at EMC KOREA 2023. He indicated that as the historically labor-intensive packaging industry has transformed into a technology-intensive one, packaging that combines various industrial technologies has emerged as an advanced technology capable of responding to diverse customer requirements and product development.