Intel is expanding its collaboration to optimize next-generation 5G infrastructure, including producing Ericsson's 5G SoC based on its 18A process technology.

Intel announced on the 27th that it has signed a strategic cooperation agreement with Ericsson.

Under this agreement, Intel will use its 18A process and manufacturing technologies to manufacture the technologies needed for Ericsson's future next-generation 5G infrastructure.

As part of this agreement, Intel will produce custom 5G system-on-chip (SoC) solutions for Ericsson, creating industry-leading, differentiated products for future 5G infrastructure.

Additionally, the two companies will expand the scope of their collaboration to optimize 4th generation Intel® Xeon® Scalable processors with Intel® vRAN Boost for Ericsson’s cloud radio access network (RAN) solutions.

This will enable telecommunications service providers to increase network capacity and energy efficiency, and achieve greater flexibility and scalability.

“This is a significant milestone as we continue to advance our collaboration with Ericsson to collaborate broadly on optimizing next-generation 5G infrastructure,” said Sachin Katti, senior vice president and general manager of Intel’s Network and Edge (NEX) business. “This agreement demonstrates our shared vision to revolutionize and transform network connectivity, and will strengthen customer confidence in Intel’s processes and manufacturing technologies,” Intel said. “We look forward to working with Ericsson, a leading company, to build networks that are ready for an open and trusted future.”

Intel 18A is the most advanced process technology in Intel's process roadmap, which aims to complete five processes within four years. Following the introduction of the new Gate All Around (GAA) transistor architecture, known as RibbonFET, and backside power delivery, called PowerVia, in Intel 20A, Intel 18A will deliver improved performance through ribbon architecture innovation and continued geometry shrinkage. Leveraging these technologies, Intel aims to regain its process leadership position by 2025, enabling customers to bring even more advanced products to market in the future.

“Ericsson has a long-standing and close collaboration with Intel and is delighted to partner with them to manufacture our future custom 5G SoCs on Intel’s 18A process node,” said Fredrik Jejdling, Vice President and Head of Networks at Ericsson. “This is aligned with Ericsson’s long-term strategy and will contribute to building a more robust and sustainable supply chain. We will also expand on the collaboration we announced at MWC 2023 to work with the ecosystem and accelerate open radio access networks leveraging Intel Xeon-based platforms.”