Available in 62mm housing… Extended maximum current rating to 800A
Can be utilized for uninterruptible power supplies, electric vehicle fast charging, ESS, etc.

Infineon Technologies (hereinafter Infineon) has introduced a family of 62mm modules that significantly reduces static loss compared to modules using the IGBT4 chipset.

Infineon announced on the 16th that it is launching a portfolio of 62mm half-bridge and common emitter modules featuring the 1200V TRENCHSTOP™ IGBT7 chip.

The product family, available in various configurations with a proven 62mm housing, has been extended up to a maximum current rating of 800A, providing great design flexibility to designers creating high-current power solutions with higher power density and electrical performance.

This product is suitable for solar central inverters, industrial drive applications, and uninterruptible power supplies (UPS), and can also be used for electric vehicle fast charging, energy storage systems (ESS), and other advanced industrial applications.

The 62mm module family adopting the 1200V TRENCHSTOP IGBT7 chip is based on new micro-pattern trench technology and has significantly reduced static losses compared to modules adopting the IGBT4 chipset.

This significantly reduces losses in applications, and is particularly applicable to industrial drives operating at medium switching frequencies.

NewThe operating power module features improved oscillation operation and control of the IGBT and a maximum overload junction temperature of 175°C.

The sturdy nickel-coated copper base plate and screw main terminals ensure high mechanical rigidity with a 62mm module housing.

Since the main terminals are located in the center of the housing, they are suitable for parallel circuits and 3-level configurations with low inductance DC link connections, and they are mechanically compatible with previously released products as they retain the standard package design and specifications within the module family.

In addition, all modules are also available in versions pre-applied with Infineon's proven thermal interface materials (TIMs).