As Nepes succeeded in localizing the plating solution used as a key material for next-generation semiconductors such as HBM and DDR5, high sales growth is expected in proportion to the growth of high-performance DRAM semiconductors and AI semiconductors in the future.


The Nepes Electronic Materials Division announced on the 4th that it has been producing plating solution, a functional semiconductor material that has been entirely dependent on imports, through its own research and development and collaboration for a long time and has been producing it initially since two years ago. It has been adopted for the TSV factory for HBM and will begin full-scale mass production this year.

The plating solution domestically produced by Nepass is a plating solution used for DDR-5 and later products and HBM for fine processes. It is recognized as a product specialized for fine processes of 10 nanometers or less due to its excellent performance, fairness, and product uniformity.

The sales of plating products in 2024 are expected to reach 45 billion won, and a high growth rate of 30-40% per year is expected.

The Nepes Electronic Materials division is expected to generate sales of KRW 95 billion in 2024, and is expecting remarkable sales growth of KRW 190 billion in 2026 in proportion to the growth of high-performance DRAM semiconductors and AI semiconductors.

In addition, Nepass has been collaborating with the Chemical Research Institute for a long time on PSPI (Photosensitive Polyimide), one of the core functional materials along with the plating solution.We have completed the first stage of development through upgrading and are currently adjusting it to suit the characteristics of the customer product.

PSPI material, which is an interlayer insulation material, is used for high temperature (375 degrees Celsius) and low temperature (200 degrees Celsius). The company said that it has started providing samples of the low-temperature product, which has particularly good characteristics, to several Taiwanese companies and is expecting to see visible results soon.

Meanwhile, semiconductor materials are divided into functional materials and process materials. Functional materials are materials that remain in the product and function until the end of the product's lifespan. The three key materials are Cu plating, PSPI (Photosensitive Polyimide), and EMC (Epoxy Molding Compound). Most of them are expensive materials that depend on imports.