"Mobile PCB area decreases, EMI increases"... Conformal shields kill two birds with one stone.
Published2024.07.17 10:46As trends in advanced device development move toward miniaturization, multifunctionality, and battery-based operations, the placement of chip-to-chip and chip-to-component interconnections within products is becoming densely packed, much like the interior of an express train on Line 9 during rush hour. With EMI issues on the rise, industry players are working on countermeasures through packaging and material-based solutions.
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