"We will lead the AI era with world-first, beyond-best, and optimal innovation technologies."

SK Hynix CEO Kwak No-jung delivered a keynote speech titled “A New Journey of Next-Generation AI Memory, Beyond Hardware to Everyday Life” at the “SK AI Summit 2024” held at COEX in Samseong-dong, Seoul on the 4th.

CEO Kwak No-jeong said that recording and leaving behind something is a human instinct, and that murals and paper from the past are now being converted into data through memory semiconductors, and that in the coming era of AI, memory will have an expanded meaning of 'creativity' and 'experience'.

SK Hynix emphasized that this is the 'creative memory' of the future that it envisions, and that such a change cannot be realized without next-generation memory semiconductors that support powerful computing power.

To this end, SK Hynix is currently developing and mass producing the world's first &lsquoHe stated that the company is preparing a variety of "World First" products and plans to launch "Beyond Best" products with unparalleled competitiveness. He also stated that the company plans to introduce "Optimal Innovation" products for system optimization in the AI era.

First of all, the 16-layer market is expected to open in earnest starting with HBM4, and in preparation for this, SK Hynix is developing a 48GB 16-layer HBM3E to ensure technological stability, and announced that it plans to provide samples to customers early next year.

In particular, to produce the 16-layer HBM3E, SK Hynix plans to utilize the Advanced MR-MUF process, which has proven its mass production competitiveness in 12-layer products, and is also developing hybrid bonding technology as a backup process, it said.

In addition, the company is developing the LPCAMM2 module, which is expected to be used in PCs and data centers in the future due to its low-power and high-performance capabilities, and is developing 1cnm-based LPDDR5 and LPDDR6. Additionally, NAND announced that it is preparing PCIe 6th generation SSD, high-capacity QLC-based eSSD, and UFS 5.0.

Furthermore, it was mentioned that the logic process will be introduced to the base die starting with HBM4.

In addition, Custom HBM is a product that optimizes performance by reflecting various customer needs such as capacity, bandwidth, and additional functions, and it was announced that it will become a new paradigm for future AI memory.

Lastly, he said that they are developing technologies to add computational functions to memory to overcome memory bottlenecks, and that technologies such as PIM (Processing in Memory) and Computational Storage are essential technologies for the future when dealing with extremely large amounts of data, and that they will be a great challenge that will change the structure of next-generation AI systems and the future of the AI industry.