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STMicroelectronics Bridging the Gap Between Bulk and Surface Microfabrication Technologies for Key Sensors

Google 우선 소스Published2014.11.19 18:19

Achieving the sensitivity of bulk micromachining technology at a cost close to that of surface micromachining technology
The Telmar 60 manufacturing process enters full-scale mass production

November 18, 2014, Seoul – STMicroelectronics (ST), a global semiconductor company contributing to customers across various electronic applications and the world's leading manufacturer and supplier of Micro-Electro-Mechanical Systems (MEMS) for consumer and mobile[1] and automotive[2] applications, announced that it has begun applying its proprietary THELMA60 (60µm epi-poly layer for micro-gyroscopes and accelerometers) surface microfabrication fab process, which has received the latest certification, to the production of MEMS sensors.

Until now, semiconductor manufacturers have used two processes to mass-produce three-layer MEMS devices with high accuracy, such as accelerometers, gyroscopes, microphones, and pressure sensors. Of these, surface micromachining is more cost-effective, while bulk micromachining has been used to increase sensitivity and precision. ST's innovative technology combines the advantages of both processes, which is expected to provide an opportunity to introduce surface-machined MEMS to new markets and applications.

Jean-Christophe Eloy, Chairman and CEO of Yole Développement, said, “Many companies have attempted to increase the precision and sensitivity of bulk micromachining to meet the demands for high mass production efficiency in the growing IoT, consumer, and mobile markets, but have failed. ST has innovatively and efficiently solved this problem with this new 60µm epitaxial layer surface micromachining process.”

Benedetto Vigna, Senior Vice President and General Manager of the Analog, MEMS and Sensors Group at ST, stated, “The introduction of ST’s Telmar 60 surface micromachining process heralds a new era for inertial sensors. As evidenced by several DesignWin cases already in production, it is an ideal solution for increasing cost efficiency in demanding applications requiring high sensitivity, such as high-end sensors for bio-implantable medical devices, seismic exploration, and aerospace systems.” He added, “We have revolutionized the consumer inertial sensor market and are now shifting our focus to high-end sensor applications. This is just the beginning.”

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