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[2025 e4ds Tech Day] NI Director Sung Woong-yong, “High-Power Semiconductor Life Prediction Completed with Dynamic Reliability Testing”

Google 우선 소스Published2025.08.12 14:37

"Dynamic reliability testing completes lifespan prediction for high-power semiconductors."
Differences in dynamic voltage application tests for power semiconductors and power modules
Design and process changes after physical analysis following reliability testing


[Editor's Note] In various industries, including electric vehicles, semiconductor failures can be life-threatening, making reliability essential and lifespan prediction paramount. Therefore, testing under various stress conditions and then conducting physical analysis to determine whether design or process changes are necessary is crucial. This requires a reliable test solution for semiconductor lifespan prediction. NI will present its "High-Power Semiconductor Dynamic Reliability Test Solution" at the " 2025 e4ds Tech Day " on September 9th. Accordingly, we met with NI Director Sung-Woong Yong, who was presenting the presentation, to learn about the dynamic reliability test solution.


■ I am curious about the dynamic reliability testing solution that will be introduced this time, and how it differs from existing methods.

The Dynamic Reliability Test Solution covers DGS (Dynamic Gate Stress), DRB (Dynamic Reverse Bias), D. H3TRB (Dynamic High-Huidity, High-Temperature Reverse Bias), and D. H3TRB, as guided in the Lifetime Testing section of AQG-324. It refers to equipment capable of testing HTFB (Dynamic high-temperature forward bias).

The biggest difference from existing static test solutions is that it tests power semiconductors or power modules by applying dynamic voltage.

The difference from the static test, which inputs a static voltage, is that the test is conducted under voltage stresses close to those that semiconductors may receive in an actual application environment.

■ Why is predicting the lifespan of WBG semiconductors particularly important? I am also curious about how test results are reflected in actual product design or supply processes.

WBG semiconductors can be used in various industries, but research and development have been significantly boosted as the electric vehicle market grows.

In automobiles, the reliability and lifespan prediction of semiconductors are more important than anything else, as even minor component defects or malfunctions can lead to a high probability of death.

Automotive semiconductor reliability testing is not conducted in a single method, but rather the semiconductor itself or module type product is tested by reflecting the various stress conditions listed in AQG-324.

However, this does not mean that the product design or process is changed based on the reliability test results obtained here. Rather, design changes or process changes are made after the cause and effect analysis is completed using physical analysis methods on products that have completed reliability tests.

I am curious about what requirements NI receives most frequently from clients or partners, and how NI's technical support is provided.

Currently in the Power Semiconductor field The questions and requirements that NI is receiving include 'what solutions NI has,' 'direct questions about AQG-324,' and 'whether there is equipment capable of performing power semiconductor reliability tests.'

NI is striving to support customers by advancing core technologies, while directly and indirectly listening to the requests and obstacles of customers requiring Power Semiconductor reliability testing through its German research institute and participating as a member of AQG-324.

In addition, NI Korea is training dedicated engineers for customer support.

■ What will be the focus of the presentations at the 2025 e4ds Tech Day?

The presentation title is "High-Power Semiconductor Dynamic Reliability Test Solution," introducing a dynamic reliability test solution for accurate lifespan prediction of WBG high-power semiconductors.

In addition, we plan to provide practical information and insights on testing high-power semiconductors made of SiC and GaN materials according to the latest industry standards.

■ A word to readers

NI possesses the best technology and know-how in Power Semiconductor reliability dynamic testing and is the world's leading dynamic test solution provider, offering solutions to solve the difficulties of many customers around the world for several years.

I think it would be a good idea to take the opportunity to experience NI solutions through this Tech Day.

Meanwhile, 'Registration for the '2025 e4ds Tech Day' is available on the official website ( https://www.e4ds.com/conference/techday/ ).
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