Lam Research, a global semiconductor equipment company, supports next-generation semiconductor packaging technology for the era of artificial intelligence (AI) and high-performance computing (HPC).

Lam Research announced on the 11th that it recently launched its innovative deposition equipment, 'VECTOR® TEOS 3D'.

This device addresses technical challenges arising from 3D die stacking and chiplet-based high-density heterogeneous integration processes, and is attracting attention as a key foundation for implementing AI-accelerated architectures.

VECTOR® TEOS 3D combines Lam's proprietary wafer bow handling technology, dielectric deposition technology, and Lam Equipment Intelligence® capabilities to deliver uniform inter-die gapfill down to 100 microns thick.

In particular, it enables the deposition of the industry's thickest, void-free film, enabling stable processing even on wafers subject to extreme stress and warpage.

“VECTOR® TEOS 3D delivers differentiated innovation that meets the demands of the AI era that goes beyond Moore’s Law,” said Sesha Varadarajan, senior vice president, Global Products Group, Lam Research.“This will be an opportunity to add powerful solutions to our advanced packaging portfolio,” he said.

Due to the recent rapid development of AI technology, semiconductor manufacturers are adopting advanced 3D packaging technology that places memory and processing units in close proximity.

On the other hand, as the die height and complexity increase, various defects such as wafer warpage, film cracks, and voids occur, resulting in a decrease in yield.

To address these challenges, VECTOR® TEOS 3D deposits dielectric films with nanoscale precision, and its clamping technology and pedestal design ensure stable wafer fixation and thermal and mechanical stress distribution.

Additionally, Lam Research's proprietary Quad Station Module (QSM) architecture delivers approximately 70% higher throughput through parallel processing and up to 20% lower cost of ownership. Equipment intelligence technology enhances process repeatability and reliability, while a high-efficiency RF generator and ECO mode control improve energy efficiency.