Freescale's plastic packaging allows for very small mechanical tolerances, providing compatibility with large-scale soldering processes and offering 30% lower thermal resistance performance compared to ceramic package transistors.

This thermal resistance performance, combined with the new product's high efficiency and gain performance, helps lower system costs through enhanced performance and reduced heat dissipation material costs. The new products are power transistors ideal for industrial and broadcast applications, including CO2 lasers, plasma generation equipment, MRI amplifiers and particle accelerators, and FM and VHF broadcast transmitters.

Paul Hart, Executive Vice President and General Manager of Freescale’s RF Business Unit, stated, “The new product continues Freescale’s long tradition of delivering significant RF innovation to the industrial sector. Providing the advantages of plastic packaging without compromising RF performance is a major step forward, enabling our customers to use it to develop differentiated and successful end products in highly competitive industrial markets.”

In addition to the ultra-high performance of the new devices, Freescale also offers a family of ultra-durable transistors designed for use in harsh industrial environments ranging from 1 to 600 MHz. With this product announcement, Freescale’s industrial portfolio now consists of five ceramic and five plastic segments, covering a power requirement range of 25W to 1250W.

Supply situation

The MRFE6VP61K25N is currently in production, while the MRFE6VP6600N is in the sampling stage and is scheduled for production in April. Detailed product information can be found on the Freescale website (www.freescale.co.kr) or through official distributors.

More details about the support tools, including reference circuits and simulation models, can be found at http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=MRFE6VP61K25N.