A forum has been established to share domestic research results on advanced packaging technology, which is rapidly emerging as a game changer in the semiconductor industry, and to collaborate to strengthen industrial competitiveness.

The Ministry of Science and ICT (Minister Bae Kyung-hoon) and the National Research Foundation of Korea (Chairman Hong Won-hwa) held the '2025 Advanced Packaging R&D Project Annual Technology Exchange Meeting' at the Jeju Grand Hyatt from October 29th to 30th.

This event was designed to share research results in the field of advanced packaging, a core technology in the domestic semiconductor industry, and to strengthen the industry-academia-research cooperation network.

This technology exchange meeting was held with a focus on the achievements of four major R&D projects supported by the Ministry of Science and ICT: △Semiconductor Advanced Packaging Core Technology Development Project, △Next-Generation Semiconductor Response Micro-Substrate Technology Development Project, △Next-Generation Semiconductor Equipment Source Technology Development Project, and △Next-Generation Optical Packaging Technology Development Project.

The event was attended by approximately 200 researchers from major domestic research institutes and companies, including LG Innotek, Simtek, Sungkyunkwan University, and the Electronics and Telecommunications Research Institute (ETRI), who shared trends in technological development.

Hosted by the Next Generation Intelligent Semiconductor Business Group (Director Hyungjun Kim), this exchange meeting was attended by a total of 857 researchers from 73 organizations, who presented the research status and results of 22 projects.

In particular, operated by the Ministry of Science and ICT The steering committee and technology council general meeting of A-SiX (Advanced Semiconductor in package eXperience) and APOLO (Advanced Packaging with Opto-chipLet Objective), which are performance support platforms in progress, were also held, where experts from industry, academia, research, and government had time to review the status of domestic technology development and discuss future policy directions.

Director Kim Hyung-jun said, “Advanced packaging technology is emerging as a game changer in the semiconductor industry, and this technology exchange meeting will be an important opportunity to go beyond the achievements of individual projects and confirm the possibility of convergence and linkage,” and emphasized, “Continued cooperation and technological innovation are necessary to strengthen industrial competitiveness.”