Applied Materials has unveiled three new products for next-generation logic processes to respond to the paradigm shift in semiconductor technology driven by the spread of artificial intelligence (AI).

Applied held a media briefing at the Chosun Palace Seoul Gangnam on the 12th and unveiled key process equipment capable of simultaneously boosting the performance and energy efficiency of AI semiconductors.

The event began with a welcome speech by Park Kwang-sun, CEO of Applied Materials Korea.

CEO Park Kwang-sun emphasized, “With AI semiconductor performance facing the limits of a single chip, system-level joint optimization encompassing logic, memory, and packaging is essential,” adding, “Applied is building an ecosystem that can dramatically shorten the speed of technology development through cooperation with customers.”

CEO Park Kwang-sun also announced plans to strengthen global semiconductor cooperation through the 'Epic Center,' scheduled to open in Silicon Valley, USA, and the 'Korea Collaboration Center,' a collaboration hub in Korea.
Kevin Moras, Vice President of Semiconductor Product Marketing at Applied Materials, then addressed the structural changes in the industry that the spread of AI will bring.


Vice President Kevin Moras pointed out, “AI is spreading beyond cloud data centers to all areas, including autonomous driving, robotics, and home appliances,” adding, “The problem is energy.”

Citing the forecast that power consumption of AI data centers could reach twice the annual electricity usage of Korea, it was emphasized that more than 10,000-fold improvements in energy efficiency across the entire AI stack are required by 2040.

The explanation is that for this to happen, innovation and collaboration across the entire spectrum, from software to chip design and manufacturing processes, are essential.

The highlight of the event was the three new products for logic processes announced by Michael Chuzik, Vice President of Semiconductor Technology at Applied Materials.


Vice President Chuzik stated, “The GPU is at the center of the AI revolution, and GPU performance and power efficiency are transistors.” "It depends on structural innovation," he said.

In particular, it was emphasized that the Gate-All-Around (GAA) structure, which is becoming fully operational in the 2-nanometer process, is key to performance improvement and low power consumption, but that manufacturing difficulty increases rapidly.

The first new product is the 'Viva Radical Treatment System'. This equipment precisely refines the silicon surface in GAA nanosheet structures to the atomic level, minimizing scattering that occurs during charge transfer.

This increases carrier mobility, and consequently, allows for simultaneous improvement of transistor performance and energy efficiency.

Vice President Chuzik explained, “Removing fine surface roughness and contamination is the starting point of 3D nanosheet performance.”

The second is the 'Sym 3Z Magnum Etching Equipment'.

This equipment forms very vertical and smooth contact holes to allow uniform access to each of the three-dimensionally stacked nanosheets.

Precise ion control technology enables identical electrical characteristics to be realized in the upper, middle, and lower nanosheets, contributing to increased reliability and yield of next-generation logic devices.

The third new product is the 'Spectra Molybdenum ALD System'.

This equipment implements low-resistance metal connections by selectively depositing molybdenum inside the contact holes.

It is considered a key technology that minimizes signal loss in highly integrated GAA structures and enables the implementation of high-performance, low-power AI chips.

“Semiconductors in the AI era must operate faster and with less energy,” said Vice President Chuzik. “The three new products unveiled this time will be a significant technological turning point that overcomes the complexity of 3D logic devices and makes the spread of AI sustainable.”