Semiconductor particle control specialist JEDEX has launched the 'M802ESC', a system capable of precision particle inspection of key process components such as electrostatic chucks (ESCs), sputtering targets, and FOUPs.

On February 19th, ZEDEX unveiled the M802ESC, the next-generation model of the existing M2000ESC, and announced that it had been newly developed to support nanoscale ultra-fine processes. The company explained that the product reflects the industry trend of increasing importance of particle management on component surfaces as microprocessing expands.

The M802ESC is designed for components that have been difficult to quantitatively evaluate using conventional methods due to their large, heavy structure and surface precision issues. It supports samples up to 610 mm in diameter and loads of up to 50 kg. It can detect particles larger than 0.1 µm by default, and an optional 10 nm sensor can count ultrafine particles. It uses a scanning nozzle method based on X, Y, and Z robot control to uniformly inspect approximately 90% of the surface.

Additionally, it was revealed that sample contamination was minimized by applying a non-contact particle extraction system. It is designed to block secondary contamination during the inspection process through a patented recovery head and particle diffusion prevention structure, and it is explained that it maintains a Class 1 ultra-clean environment based on a ULPA filter to ensure data reliability.

Zedex anticipates that data-based management will transform the process yield management system, enabling even parts previously subject to limited quantitative inspection. With the advancement of microprocessing and the consequent strengthening of particle management at the component level, attention is focused on whether the expanded inspection scope will have an impact on yield stabilization.