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AI Semiconductor Era, Key is 'Materials Technology'… KIEC Holds Seminar on High-Performance Semiconductor Materials
April 24 FKI Tower, Samsung Electronics, Air Liquide, Qunity Electronics, and others to make announcements
Amid the rapid growth of the global semiconductor market driven by increased investment in AI data centers and rising demand for High Bandwidth Memory (HBM), a specialized seminar will be held to provide an overview of next-generation semiconductor materials and packaging technologies.
The Chemical Economics Research Institute announced that it will hold a 'High-Performance Semiconductor Material Technology Seminar' on April 24 at the Korea Economic Association FKI Tower in Yeouido, Seoul.
This event was organized to share the latest trends and future directions of front-end and back-end semiconductor material technologies, which are becoming increasingly important due to the expansion of AI infrastructure.
Although recent geopolitical risks in the Middle East are acting as a variable, expectations for a memory-centric supercycle persist as DRAM supply becomes tight due to increasing demand for AI servers and data centers.
Accordingly, interest is also growing in high-performance material technologies that support the entire semiconductor process, such as CMP pads, specialty gases, and heat dissipation materials.
This seminar will feature key figures from domestic and international semiconductor material companies, including Samsung Electronics, Air Liquide Korea, Qunity Electronics, Wacker Chemie, and Kookdo Chemical, as well as semiconductor specialists such as Mobilint, Bose Semiconductor, and IVWorks, as speakers.
The event consists of two sessions: a pre-process and a post-process.
In the front-end process session, AI semiconductor industry outlook, automotive &Trends in physical AI semiconductor technology, gallium nitride (GaN) epiwafers, and ultra-high purity specialty gas technology are covered.
In the back-end process session, practical application examples and development directions for high-performance semiconductor packaging, including thermal management materials, silicon and epoxy materials, and CMP pad technology, are scheduled to be introduced.
An official from the Chemical Economics Research Institute stated, “The core of competitiveness in AI semiconductors lies not only in the devices themselves but also in the materials technology that supports them,” adding, “This seminar will be a meaningful opportunity to examine the development trends of next-generation semiconductor materials in one place.”
Applications for the seminar are being accepted on a first-come, first-served basis through the official website of the Chemical Economics Research Institute. Early bird discounts are available until March 27, and pre-registration is available until April 22.
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