ROHM has developed the 'AG16xFNxx series,' an 80V withstand voltage MOSFET designed for 48V automotive power systems, and has begun mass production. The new product is an automotive power semiconductor designed with a compact package and heat dissipation structure to meet the increasing power output of automotive electronic systems.

ROHM began mass production of the AG160FNS4FRA and AG166FNH7FRA through its headquarters in Kyoto, Japan, starting in April. These two products are 80V withstand voltage MOSFETs used in 48V automotive power systems and are supplied in HPLF5060 and DFN3333 packages, respectively.

The demand for power in automotive electronic systems is increasing due to electrification and the expansion of convenience and safety features. As the existing 12V power structure alone has limitations in handling high-output loads, the application of 48V power systems is expanding, particularly in certain vehicle models. The 48V system is advantageous in reducing wiring burden and power loss because it can lower the current while supplying the same amount of power.

This structural change is also affecting MOSFETs. In 48V power systems, 80V withstand voltage products are considered as an alternative to typical 100V withstand voltage products, as they can reduce losses. The AG16xFNxx series is intended for use in 48V power systems within vehicles, such as main inverter control circuits, electric motors, and electric water pumps.

The package configuration also differs from existing automotive MOSFETs. The AG16xFNxx series uses HPLF5060 and DFN3333 packages, which are smaller than the TO-252 package. The HPLF5060 features a gull-wing lead structure, while the DFN3333 utilizes wettable flank terminals. Wettable flanks are used in the inspection process of automotive electronic components because they facilitate easy verification of the soldering status after board mounting.

Copper clip bonding was used for the heat dissipation structure. This method reduces the electrical and thermal paths between the chip and the lead frame, aiding in thermal management during high-current operation. It is a design intended to ensure current handling capability while utilizing a compact package.

ROHM is also developing TOLG package products. As 48V automotive electronic systems expand, automotive MOSFETs are shifting toward a demand for low loss, small size, and mounting reliability simultaneously.