As the power and cooling densities of data centers rapidly increase due to the surge in demand for AI computing, Schneider Electric and AMD have jointly developed a reference design for building high-density AI infrastructure. This outcome is the first example of collaboration between the two companies and is noteworthy for presenting design standards that integrate power, cooling, IT space, and software.

Schneider Electric announced on the 29th that it had jointly developed and verified a reference design for AMD Helios rackscale solutions with AMD.

The reference design supports a modular multi-cluster structure scalable up to 10.4MW IT capacity based on greenfield deployment standards and is designed to handle AI workloads of up to 246kW per rack.

The reference design encompasses four technology areas: Facility Power, Facility Cooling, IT Space, and Lifecycle Software.

Schneider Electric explained that the cooling section utilizes liquid cooling technology combining a Motivair-based CDU and a hybrid air-water cooling method, achieving up to 84% heat removal performance.

The PUE at full load is approximately 1.12.

In terms of software, it is configured to verify power and thermal designs using ETAP and EcoStruxure IT Design CFD, and to model, analyze, and manage infrastructure performance using Electrical Digital Twin capabilities.

It also supports real-time monitoring of the entire power, cooling, and IT infrastructure through integration with the AVEVA Unified Operations Center.

We have currently completed ANSI standard verification for the US market and plan to expand the scope of verification to IEC standards in the future.

Forrest, Executive Vice President of AMD's Data Center Solutions Business Group Forrest Norrod stated, “AI infrastructure is rapidly evolving into an AI factory, and to achieve this, computing, networking, power, and cooling must be designed together from the ground up,” adding, “Through this reference design, customers will be able to quickly build high-density AI environments and reduce system integration risks.”

Manish Kumar, Executive Vice President of Schneider Electric’s Secure Power and Data Center business unit, stated, “Now is the time for reference designs that can connect AI infrastructure from the planning stage to deployment with low risk,” adding, “Through our collaboration with AMD, we will support customers in building high-density AI environments by providing engineering-based design standards.”