인피니언 8월20일부터
This page was machine-translated and may differ from the original. View original

ST launches VD56GA 1.1MP image sensor for in-vehicle cabin sensing

Google 우선 소스Published2026.09.15 10:12


 
35% improvement in clarity and 60% improvement in infrared sensitivity over previous generation, supporting expanded DMS/OMS deployment
 
As in-vehicle cabin monitoring technology expands from premium vehicles to mass-production platforms, STMicroelectronics (ST) has introduced an automotive image sensor designed to lower cost barriers and enable driver and occupant monitoring functions across diverse vehicle models.
 
On the 15th, ST launched the VD56GA, a 1.1MP automotive image sensor for infrared-based in-vehicle cabin sensing.

Belonging to the 'ST SafeSense by ST' product family, this sensor enables OEMs and tier-1 suppliers to expand driver monitoring systems (DMS) and occupant monitoring systems (OMS) across multiple vehicle lines, ST announced.
 
Supporting automakers' expanded monitoring capabilities
 
The VD56GA adopts 'ST DeepNIR', a backside-illuminated pixel architecture optimized for infrared imaging.

Compared to the previous generation, modulation transfer function (MTF) clarity is improved by 35%, and quantum efficiency is enhanced by approximately 60%, ST explained.

The use of low-cost optical components, simplified infrared illumination, and optical filtering with lower specification requirements enables overall camera module cost reduction.
 
Alexandre Balmefrezol, Senior Vice President and General Manager of ST's Imaging Subgroup, stated, "In developing the VD56GA, we focused on image quality in infrared environments, compact integration, and cost structure supporting mass-production programs."
 
Anas Chalak, analyst at Yole Group, said, "Driver and occupant monitoring system volumes are expected to exceed 70 million units by 2031," highlighting that imaging performance, system cost reduction, and integration simplification capability are key to market success.
 
Embedded processing functions and compact package
 
The VD56GA is supplied in a 3.7mm × 3.2mm CSP (Chip Scale Package), making it suitable for space-constrained environments.

It features embedded image processing functions including △mirror △crop △dark calibration △auto exposure △piecewise linear processing, enabling camera design without external image processing devices, ST announced.

Supporting both RAW and YUV output formats, it can flexibly adapt to diverse electronic architectures and software environments.
 
ST announced earlier this year that cumulative shipments of 'ST SafeSense' automotive image sensors surpassed 10 million units.

Front-end manufacturing of the VD56GA is conducted at ST's Crolles fab in France, while packaging is performed in the Asian region.
 
Sample supplies are currently underway. For pricing information and sample requests, please contact ST Korea.
To request a correction, reply or follow-up report on this article, see how to file a request. Previously published statements are collected in corrections & replies.
배종인 기자
배종인 Reporter

Comments