ASM launches PECVD-based 'Flowable Carbon' technology

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ASM launches PECVD-based 'Flowable Carbon' technology

Published2026.09.30 08:58

Single-process integration of gap fill and planarization aims to simplify patterning processes for logic and memory devices

As semiconductor devices evolve into increasingly complex 3D structures, new process material technologies are required to overcome the limitations of existing carbon film technology. ASM has introduced a new technology that implements gap fill and planarization in a single process. The company explained that this technology can be applied to both logic and memory devices, reducing dependence on subsequent processes and thereby reducing manufacturing costs and defect risks.

ASM unveiled the 'XP8® Vertos™ Flowable Carbon' technology based on PECVD (plasma-enhanced chemical vapor deposition) on the 30th.

It is the first instance of simultaneously implementing gap fill and planarization in a single PECVD process, integrating processes that previously proceeded in multiple steps into a single platform.

It is currently being applied in early mass production.

XP8® Vertos™ Flowable Carbon operates by uniformly filling material from the bottom without voids or defects inside trenches even in deep, narrow high-aspect-ratio structures, and self-planarizes the surface throughout the wafer, ASM explained.

Since it is implemented in an all-in-one PECVD system, there is no need to undergo CMP (chemical mechanical planarization) or etch-back processes in subsequent steps, the company added.

ASM CEO Hitachi Emsad stated, "Material innovation must support not only advances in device structures, and chips with this technology applied will deliver faster and more efficient AI performance."

ASM announced that this technology implements fluidity along with thermal stability and Area Selective Deposition (ASD) characteristics on a single platform.

The company explained that planarization levels can be improved even on substrates with varying pattern densities, providing scalability to address current and future technology nodes.

Tyler Sample, ASM PECVD Vice President, stated, "While existing carbon films required additional processes because surface step issues carried over to the next stage, Vertos™ Flowable Carbon fundamentally changes this process method."

According to the Semiconductor Industry Association (SIA), the semiconductor market is projected to reach $1.5 trillion (approximately 2,048 trillion won) by 2026.

ASM is a semiconductor wafer process equipment company headquartered in the Netherlands, and operates an R&D center and manufacturing facility in Dongtan, Hwaseong, Gyeonggi.

#ASM #PECVD #반도체 공정 #CMP #AI칩 #Flowable Carbon #갭필 #평탄화

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