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Focus on system -level performance of 5+ watts and ' anytime , anywhere ' connectivity
Xilinx Korea announced on October 1, 2015 that it will launch its 16nm multiprocessor SoC (MPSoC) one quarter ahead of schedule.
Zynq® UltraScale+™ MPSoCs , built on TSMC’s 16FF+ process, deliver over 5X system-level performance per watt and “anywhere” connectivity with security and safety features for next-generation systems.
This technology, which leads to the development of embedded vision, ADAS, Industrial Internet of Things (IIoT), and communication systems, is available early, enabling a head start on designing MPSoC-based systems.
“TSMC’s long-standing collaboration with Xilinx has enabled us to rapidly complete our world-class 16nm FinFET multiprocessing SoCs,” said Dr. BJ Woo, vice president of business development at TSMC. “This delivers industry-leading silicon performance at the lowest power consumption achieved by Xilinx and TSMC, along with a high degree of system integration and intelligence across our All Programmable Logic products.” Added.

The Zynq UltraScale+ MPSoCs integrate seven user-programmable processors, including a 64-bit quad-core ARM® Cortex™-A53 application processor unit (APU), a 32-bit dual-core ARM® Cortex™-R5 real-time processor unit (RTPU), and an ARM® Mali™-400 graphics processor unit (GPU). When used with the SDSoC™ development environment, the Zynq UltraScale+ MPSoC family enables systems that are both software-defined and hardware-optimized.
“The rapid introduction of our Zynq UltraScale+ MPSoC 16nm devices represents another milestone in total execution and flawless quality,” said Victor Peng, vice president at Xilinx. “Following 28nm, 20nm, and now being first to market with a pioneering 16nm product, we have achieved a ‘three in a row’ feat.”
Xilinx will be demonstrating its All Programmable Zynq UltraScale+ MPSoC devices at ARM TechCon, taking place November 10-12 in California, USA.
Xilinx Korea announced on October 1, 2015 that it will launch its 16nm multiprocessor SoC (MPSoC) one quarter ahead of schedule.
Zynq® UltraScale+™ MPSoCs , built on TSMC’s 16FF+ process, deliver over 5X system-level performance per watt and “anywhere” connectivity with security and safety features for next-generation systems.
This technology, which leads to the development of embedded vision, ADAS, Industrial Internet of Things (IIoT), and communication systems, is available early, enabling a head start on designing MPSoC-based systems.
“TSMC’s long-standing collaboration with Xilinx has enabled us to rapidly complete our world-class 16nm FinFET multiprocessing SoCs,” said Dr. BJ Woo, vice president of business development at TSMC. “This delivers industry-leading silicon performance at the lowest power consumption achieved by Xilinx and TSMC, along with a high degree of system integration and intelligence across our All Programmable Logic products.” Added.

The Zynq UltraScale+ MPSoCs integrate seven user-programmable processors, including a 64-bit quad-core ARM® Cortex™-A53 application processor unit (APU), a 32-bit dual-core ARM® Cortex™-R5 real-time processor unit (RTPU), and an ARM® Mali™-400 graphics processor unit (GPU). When used with the SDSoC™ development environment, the Zynq UltraScale+ MPSoC family enables systems that are both software-defined and hardware-optimized.
“The rapid introduction of our Zynq UltraScale+ MPSoC 16nm devices represents another milestone in total execution and flawless quality,” said Victor Peng, vice president at Xilinx. “Following 28nm, 20nm, and now being first to market with a pioneering 16nm product, we have achieved a ‘three in a row’ feat.”
Xilinx will be demonstrating its All Programmable Zynq UltraScale+ MPSoC devices at ARM TechCon, taking place November 10-12 in California, USA.
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