The camera's onboard MachXO3 FPGA provides I /O speeds of up to 900Mbps.

Lattice Semiconductor announced that its new USB 3.0 camera module has been integrated into embedded camera company Leopard Imaging's new USB 3.0 camera module.

The MachXO3 FPGA and USB 3.0 sensor bridge reference design combine to convert the subLVDS video signal from the image sensor used in this camera module into a parallel signal that can interface with the camera's USB 3.0 controller. This embedded camera module's ability to convert the video signal into a format compatible with the USB controller makes it suitable for use in a wide range of industrial systems.

“With so many different video standards being used in embedded applications, it’s essential to be able to convert those signals into the formats required by specific industrial systems,” said Bill Pu, President of Leopard Imaging. “Lattice Semiconductor’s MachXO3 FPGA provides both the programmability and bridging capabilities required by our USB 3.0 camera modules in a compact form factor.” “Lattice’s sensor bridge reference design also allows us to more quickly integrate Lattice’s technology into Leopard Imaging’s final products,” he said.


HD video images can be converted without compromising system performance .

“Camera image sensor interfaces are a growing feature in embedded applications,” said Deepak Boppana, director of product marketing at Lattice Semiconductor. “Lattice’s MachXO3 FPGAs deliver I/O speeds of up to 900 Mbps, enabling customers to convert HD video images to any desired format without compromising video system performance.”

Reference designs are available for subLVDS, MIPI ^® CSI-2, HiSPi, USB3 FX3 controller interfaces and bridging, and can be customized for specific applications. More information about the MachXO3 FPGA family and the USB 3.0 sensor bridge reference design can be found at www.latticesemi.com .