Launch of HSAutoLink™ Interconnect System for "Connected Vehicles"

Above all, a notable trend in the automotive electronics industry is the increasing adoption of in-vehicle cameras for intelligent driver assistance systems. For example, up to six cameras are installed in various locations on the vehicle for functions such as lane departure warning, collision avoidance, and parking assistance.

In addition, as analog technology evolves into digital high-resolution 24-bit color images, the bandwidth required for passenger and commercial vehicles is also on the rise. To meet these new needs for "connected car" communication, such as inter-vehicle communication, infotainment, and telematics, Molex Korea (CEO: Jaehoon Lee, www.korean.molex.com), a specialist in electronic connectors, has launched the HSAutoLink™ interconnect system, a series of high-speed communication automotive cables.

The next-generation HSAutoLink™ II interconnect system, released in two versions—HSAutoLink with a 0.80mm pitch and HSAutoLink™ II with a 1.27mm pitch—is equipped with economical, robust, waterproof, and shielded cables and meets the rapidly changing needs of users by providing data transfer rates of up to 5 Gbps.

Ideal for connected car applications requiring higher reliability and high-speed signal processing performance due to the diverse number of applicable circuits, this product family adopts the company's Molex LFH (Low Force Helix) terminal interface technology to increase differential signal bandwidth, extend lifecycle, and provide stable contact resistance.

This product family, supplied in 6-circuit and 12-circuit configurations, enables data transfer speeds of up to 5 Gbps. In addition, by allowing link coupling, it supports multiple protocols such as USB 2.0, USB 3.0, LVDS, Ethernet AVB, HDMI, DVI, and DisplayPort on the same connector. In particular, it is equipped with a USCAR-30 interface for the introduction of high-speed in-vehicle connectivity systems.

Featuring a plug designed with a shielded case for perfect protection, this product family provides robustness and safety through rear soldering of right-angle headers with a closed-shield structure, ensuring signal integrity as well as delivering high EMI protection.

Furthermore, with IP67 and IP69K ratings, this product family provides complete ambient and wiring waterproofing, ensuring stable performance even in harsh environments and high-humidity locations. Compatibility with Shielded Twisted Pair (STP) or Jacketed Twisted Pair (JUTP) cable configurations enables cost reduction for high-speed differential signal processing applications.

The compact, small size of this product family is, above all, a structure that optimizes lateral space saving for devices capable of meeting future demands for high-speed communication links that will increase further. The PCB connectors, produced from high-temperature plastic materials, can be subjected to lead-free processing via Pin-in-Paste or lead-free selective wave soldering processes, and comply with the maximum temperature condition of 260°C specified by JEDEC.

The HSAutoLink™ II system, featuring strong water resistance, supports high-speed media protocols including USB 3.0 and provides data processing speeds of up to 5 Gbps, meeting the bandwidth requirements of in-vehicle infotainment, telematics, and camera devices.