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Artesyn Launches Microserver Platform for Cloud Networks
Published2016.05.13 06:18
Artesyn Embedded Technologies has launched the MaxCore HA platform, a high-availability version of a microserver platform used in NFV/SDN and carrier-grade cloud networks.
The network includes next-generation network facilities such as C-RAN (Centralized Radio Access Network) and vRAN (virtualized radio access network). This platform is designed for next-generation installations in space-constrained environments such as LTE deployments in China, and when installed in existing LTE networks, it meets carrier-grade high-availability requirements.
Telecom operators can leverage the versatile MaxCore architecture to create highly dense single-function appliances or deploy multiple single VNFs (Virtual Network Functions) performing voice or video transcoding on a single platform.
Operators can also achieve reduced operational and capital expenditures in cloud infrastructure deployment and scale as needed. For example, when using a single MaxCore HA system, it is possible to support a significant number of cells per RAN in a compressed footprint, offering substantial savings in cooling costs and power consumption compared to traditional rack-mount server (RMS) approaches using L1 technology.
Todd Wynia, Vice President of Marketing for the Communications Platform division at Artesyn Embedded Technologies, stated, "Estimates show that when telecom operators use the MaxCore HA platform for C-RAN or vRAN infrastructure deployment, they can achieve 25% cost savings per cell compared to RMS-based solutions. Meanwhile, power consumption is reduced and density is increased."
He also noted, "Through high-availability features such as hot-swap and cabling equipped on this new platform, telecom operators can implement virtualization toward network edges or support mobile edge computing technology (MEC) in the transition to 5G. Additionally, Artesyn's accelerator products can operate on existing server infrastructure as well as custom-designed or third-party PCI Express cards. This allows operators to maintain maximum flexibility during deployment without constraints."
The MaxCore HA platform can accommodate up to 384 Intel® Xeon® D processor cores, making it one of the most density-rich high-availability platforms available.
Dan Rodriguez, who oversees Intel's Communications Infrastructure division, stated, "Implementing fifth-generation (5G) communications requires powerful network edge devices with local caching capabilities. With Artesyn's MaxCore platform, you can leverage NFV and SDN technologies to achieve such an environment. This is highly flexible and transformable within Intel's architecture while also reducing operational costs."
Artesyn's MaxCore HA platform is housed in a 5U-height 19-inch standard rack enclosure and features a redundant switch card with optional 100G Ethernet interfaces and 12 hot-swap PCI Express fabric slots. Customers can flexibly configure the system through Artesyn microservers, SharpStreamer™ acceleration cards, or third-party standard PCI Express cards available for immediate purchase. These are connected through an ultra-high-speed backplane capable of high-performance single conversion without cables.
In many telecom-intensive office environments, front-access standard input/output (I/O) and front-to-rear cooling methods are preferred. This platform features system management software capabilities and Artesyn's Silver Lining™ NFV functionality that implements software capabilities. This software leverages open-source projects such as OpenFlow, OpenStack, Linux, OVS, and DPDK.
Meanwhile, Artesyn recently released two solution briefs aimed at reducing capital expenditure (CapEx) and operational expenditure (OpEx) related to C-RAN and vRAN infrastructure deployment.
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