Chip Scale Package (FX-CSP) Lineup Announced

Samsung Electronics has launched a 'Flexible Chip Scale Package (FX-CSP)' lineup that allows for the free design of automotive lighting by applying flexible substrate technology.

Chip Scale Package (CSP) is a packaging technology that eliminates the plastic mold surrounding the LED chip and the metal wires connecting the substrate and the light source. Its small size allows for more flexible product design, and the absence of metal wires results in lower thermal resistance and higher reliability due to simplified manufacturing processes.

With this, Samsung Electronics has added a 'chip scale package' to its existing lineup of mid-power and high-power automotive LED components. Samsung plans to target the market by providing optimal solutions for automotive lighting that requires a wide range of light outputs depending on the application and role.

The 'Chip Scale Package (Fx-CSP)' maximizes design freedom by using a resin substrate that can be freely cut. This product allows chips to be arranged in various forms according to the light output and design required by the customer, ranging from a 1×1 single chip array to a 2×N array, and enables individual control of each chip, making it suitable for use in all automotive exterior lights, from standard parking lights to high-intensity headlights.

In particular, it features a structure that facilitates efficient heat dissipation compared to conventional ceramic substrates, resulting in high reliability and luminous efficiency. With this lineup, Samsung Electronics recently secured a project for headlights for compact vehicles from a global automotive parts supplier.

Jacob Tan, Executive Vice President and Head of Strategic Marketing for Samsung Electronics’ LED Business Team, stated, “Our LED lineup, featuring unrivaled chip-scale packaging technology, will meet the stringent demands of the automotive industry based on high reliability and design convenience,” adding, “We plan to lead innovation in the field of LED lighting technology through continuous technological development in the future.”

Samsung Electronics, which showcased a lineup of LED lighting products featuring 'chip scale packaging' technology at the World Lighting & Architecture Fair held in Frankfurt, Germany last March, plans to accelerate its efforts to target the automotive parts market, which requires high reliability, with the launch of this product.