High-performance, low-power 14nm FinFET process applied
Implementing optimized ultra-compact solutions with state-of-the-art packaging technology

Samsung Electronics announced the mass production of the 'Exynos 7270,' a wearable-dedicated AP based on the 14nm FinFET process.

Following the expansion of the application of its high-performance, low-power 14nm advanced process—previously used in premium mobile APs—to entry-level models earlier this year, Samsung Electronics has now, for the first time in the industry,
It was also applied to APs dedicated to wearables.

The 'Exynos 7270', which uses a dual core (Cortex-A53), utilizes a 14nm process, improving operating power efficiency by more than 20% compared to existing 28nm-based products, enabling wearable device users to use the device for a long time on a single charge.

In addition, by integrating various connectivity functions such as Cat.4 LTE modem, Wi-Fi, Bluetooth, FM radio, and Global Navigation Satellite System (GNSS) into a single chip, it provides wearable device manufacturers with upgraded functionality and design convenience, including the ability to use communication network-based convenience features independently.

In addition, by minimizing system area through state-of-the-art packaging technology, it provides low-power, ultra-compact products optimized for wearable devices.

Integrated AP, DRAM, NAND Flash, and PMIC into a single package

By applying advanced packaging technology (SiP-ePoP) that incorporates AP, DRAM, NAND flash, and even PMIC into a single package, it not only implemented more functions within the same 100mm² area as the previous generation product but also reduced the package height by approximately 30%.

In addition, it provided wearable device manufacturers with a reference development platform consisting of APs, displays, NFC, and various sensors, enabling customers to develop products more quickly and conveniently.

"This product presents a new paradigm for wearable-dedicated SOCs based on low-power processes, modem and connectivity integration, and innovative packaging technology," said Heo Kuk, Senior Vice President of Strategy Marketing Team at Samsung Electronics System LSI Business Division. "It will make a significant contribution to the popularization of wearables by enabling significantly longer device usage time and a slim design."