Microchip Launches 8-Bit Microcontroller with Integrated Configurable Logic in 6- to 20-Pin Packages

New MCU applications can be implemented by integrating configurable logic cells, complementary waveform generators, and numerically controlled oscillators.

Microchip Technology (Country Manager for Korea: Byung-Don Han), a global specialist in microcontroller, analog, and flash IP solutions, unveiled several new 8-bit PIC® microcontrollers (MCUs) at the Embedded Systems Conference held in Boston. The newly introduced MCUs integrate configurable logic and advanced peripherals into 6 to 20-pin packages. In addition, the PIC10F(LF)32X and PIC1XF(LF)150X MCUs integrate new peripherals, including a Configurable Logic Cell (CLC), Complementary Waveform Generator (CWG), and Numerically Controlled Oscillator (NCO), enabling functions that were impossible with previous low-pin MCUs. Designers are expected to use these general-purpose MCUs to not only improve product functionality and reduce size in home appliances (e.g., small kitchen appliances), automobiles (e.g., interior lighting), consumer goods (e.g., power tools), and industrial markets (e.g., utility meters), but also to lower costs and power consumption.

By utilizing the CLC peripherals integrated into the PIC10F(LF)32X and PIC1XF(LF)150X MCUs, combinational logic and sequential logic can be controlled via software. This allows for a reduction in the number of external components, a reduction in code area, and the implementation of more functions by increasing the on-chip interconnection of peripherals and I/O.
CWG peripherals enhance switching efficiency by integrating with multiple peripherals to generate complementary waveforms through dead-band control and automatic shutdown. Additionally, NCO peripherals implement linear frequency control and high-resolution specifications essential for applications such as lighting ballasts, tone generation, and other resonant control circuits. The newly introduced MCU features low power consumption of less than 30µA/MHz in active mode and less than 20nA in sleep mode, and is equipped with an on-chip 16MHz built-in oscillator, an analog-to-digital converter (ADC), and up to four pulse width modulation (PWM) peripherals. In addition, a temperature indicator module is integrated, allowing for temperature measurement at a low cost.

Steve Drehobl, Vice President of Microchip Security, Microcontrollers and Technology Development, stated, “The new MCUs will expand the range of the PIC10F, PIC12F, and PIC16F families to enable new microcontroller applications that did not exist before,” adding, “These new products are characterized by an exquisite balance of unique features, power consumption, size, and cost.”

Development support
To support application development, the PICDEM™ Lab Development Kit (Part No.: DM163045) currently includes samples of both the PIC10F322 and PIC16F1507 MCUs. Additionally, the F1 evaluation platform (Part No.: DM164130-1) is provided for development work utilizing enhanced mid-range core 8-bit PIC MCUs, including the PIC1XF(LF)150X family. A CLC configuration tool is also provided free of charge to simplify the installation process of CLC modules by simulating register and combinational logic functions in a graphical user interface (GUI). This tool is currently available and can be downloaded from the Microchip website ( http://www.microchip.com/get/NWUN ).

These newly introduced MCUs are supported through Microchip’s standard development tools, such as the PICkit™ 3 Debugger/Programmer (part number: PG164130), MPLAB® IDE, MPLAB REAL ICE™ In-Circuit Emulator and MPLAB ICD3 In-Circuit Debugger, Microchip, and HI-TECH C® compilers. Currently, all of these tools can be purchased through microchipDIRECT.

Package and supply
The PIC10F(LF)320 and PIC10F(LF)322 MCUs are supplied in 6-pin SOT-23 packages, 8-pin PDIP packages, and 2mm x 3mm DFN packages. Additionally, the PIC12F(LF)1501 MCU is scheduled to be supplied in 8-pin PDIP, SOIC, MSOP, and 2mm x 3mm DFN packages, while the PIC16F(LF)1503 MCU is scheduled to be supplied in 14-pin PDIP, SOIC, TSSOP, and 3mm x 3mm QFN packages. The PIC16F(LF)1507 MCU is supplied in 20-pin SSOP, PDIP, SOIC, and 4mm x 4mm QFN packages, and the PIC16F(LF)1508/9 MCUs are also scheduled to be released in these packages.

Samples and production quantities of the PIC10F(LF)320, PIC10F(LF)322, and PIC16F(LF)1507 MCUs are currently available for order at http://www.microchip.com/get/KMFF and http://www.microchip.com/get/100U, respectively. The PIC1XF(LF)1501/3/8/9 MCUs are expected to be available for sampling and purchase in the next two quarters. For more information, please contact a Microchip sales representative or an authorized distributor worldwide, or visit the Microchip website ( http://www.microchip.com/get/X792 ). The products mentioned in the press release can be purchased by visiting microchipDIRECT or by contacting an official Microchip distributor partner.