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Free Windows Embedded CE 6.0 R3 BSP for TI OMAP-L1x and Sitara™ AM1x Devices Reduces Development Time and Cost
Published2010.08.31 19:16TI has released the OMAP-L1x floating-point DSP+ARM9™ processor, Sitara™ AM1x ARM9 MPU (microprocessor unit) and associated evaluation modules, along with a Microsoft Windows Embedded CE 6.0 R3 BSP (board support package). The BSP comes with fully tested drivers and source code, enabling developers to quickly and easily interface supported devices to the operating system. It also provides the necessary drivers and protocol stacks for integrated peripherals of various chips such as Ethernet, USB, CAN, SATA, LCD, and touchscreen controllers. The BSP for OMAP-L1x devices enables access to TI's TMS320C674x™ DSP using DSP/BIOS™ Link interprocessor communication software. DSP/BIOS Link allows developers to easily access the DSP for algorithm development using Windows Embedded CE 6.0 R3.
The OMAP-L1x and AM1x BSP are compatible with the following TI processors and associated EVMs.
• OMAP-L137 processor
• OMAP-L138 processor
• AM1707 microprocessor
• AM1808 microprocessor
• AM17x Evaluation Module
• AM18x Evaluation Module
• AM18x Experimenter Kit
• OMAPL137/C6747 Floating-Point Starter Kit
• OMAP-L138/TMS320C6748 EVM
• OMAP-L138 Experimenter Kit
Windows Embedded CE 6.0 R3 provides developers with tools and technologies that enable them to deliver differentiated devices with a comprehensive user experience comparable to Windows-based PCs, servers, and online services, along with the latest connectivity features. TI is building a reputation for flexible software solutions while expanding its product line that is already supported by Windows CE BSP, including the Sitara AM3517 and AM3505 MPU, DaVinci™ DM644x video processor, and various OMAP35x devices. (Other TI devices
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