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Lattice Launches World's Smallest FPGA with Integrated Memory and DSP

Google 우선 소스Published2016.12.13 16:43
Launch of iCE40 UltraPlus™ FPGA Product Family
Accelerating Innovation in Semiconductors, Smartphones and IoT Edge Devices


Lattice Semiconductor (Branch Manager Lee Jong-hwa) announced the launch of the new iCE40 UltraPlus™ FPGA series. The iCE40 UltraPlus product is one of the most energy-efficient programmable mobile heterogeneous computing (MHC) solutions in the industry.

The new product, newly added to the iCE40 Ultra product family, offers 8 times more memory (1.1Mb RAM), 2 times more DSP (8 total), and enhanced I/O compared to the previous generation. Available in various package sizes, the iCE40 UltraPlus product is ideal for diverse applications including smartphones, wearables, drones, 360-degree cameras, human-machine interface (HMI), industrial automation, security and surveillance products, thanks to its programmable characteristics.

The iCE40 UltraPlus product can be used for various purposes such as voice recognition, motion recognition, image recognition, haptics, graphics acceleration, signal aggregation, and I3C bridging to implement new interaction methods with electronic devices.

Furthermore, it is possible to add intelligence to IoT edge products such as smartphones as well as wearables and home audio-enabled equipment, allowing them to maintain an 'always-on' state and immediately receive and process locally without connecting to the cloud when a processing command is delivered.

The MHC paradigm employs a highly energy-efficient technique in which battery-powered devices use different types of processors to rapidly and distributively process computational algorithms in order to reduce the load on power-consuming application processors (AP). Since iCE40 UltraPlus offers more DSP, advanced algorithms can be processed quickly, and with more memory, data can be buffered to extend low-power states. Flexible I/O enables a more distributed heterogeneous processing architecture. Through the combination of these characteristics, OEMs and manufacturers can rapidly implement key innovations such as 'always-on' sensor buffering and acoustic beamforming.

It would be quite convenient if interaction with mobile products were possible without ever touching them. The iCE40 UltraPlus product enables the implementation of the responsiveness required to provide this functionality.
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