Leveraging its extensive experience collaborating with ARM, TI partnered with ARM for the first time to establish concepts and definitions for the next-generation ARM® Cortex™-A Series processor core ('Eagle'), which is scheduled to be announced later this year. TI plans to use ARM's new processors to further enhance and expand its future OMAP™ platform products. (For more information on the TI OMAP family, please visit www.ti.com/omapwireless )

TI officially joined this project last June and established a partnership with ARM. During this period, TI worked with ARM to advance the definition of processor cores by leveraging its expertise in low-power System-on-Chip (SoC) platforms. This participation has enabled TI to rapidly launch high-performance OMAP products based on new ARM processor cores, succeeding the OMAP 4 platform which utilizes powerful Cortex-A9 processor cores. This collaboration once again demonstrates TI's commitment to leading high-performance, low-power mobile technology.

TI’s upcoming OMAP platform solution aims to enrich mobile lifestyles and raise expectations for power-efficient, high-performance computing. By utilizing its proprietary SmartReflex™ power and performance management technology, TI is able to deliver industry-leading SoCs with low power consumption characteristics. Consequently, the TI OMAP platform solution, based on new ARM processor cores and SmartReflex™, will meet the mobile market's demands for powerful performance and low power consumption. TI also believes that the new ARM processor cores have potential for more general-purpose market applications across TI's product portfolio.

Remi El-Ouazzane, Vice President of TI’s OMAP Platform Business Unit, stated, “As ARM’s leading partner for the next-generation Cortex-A series processors, we have once again demonstrated TI’s unwavering commitment to supporting customers in succeeding in the highly competitive mobile market.” He added, “We are very pleased that customers can be the first to leverage the innovative technologies of the new ARM processor cores through TI’s industry-leading OMAP products. Successful achievements in the mobile industry are centered on ‘high performance, low power,’ and we believe that the results of our collaboration will once again highlight the importance of the balance that must be maintained.”