Applicable to all electronic products including printed circuit boards
It is expected to reduce carbon emissions by up to 35%.

Lenovo announced that it has developed a new Low Temperature Solder (LTS) process to improve eco-friendliness and reliability in the PC manufacturing process and is currently in the process of patenting.

The newly developed low-temperature soldering process can be applied not only to Lenovo products but also to the production of all electronic products, including printed circuit boards, without additional costs or impact on performance.

In Lenovo's cold soldering process, a mixture of solder and flux is first printed onto the surface of the circuit board. Subsequently, components are added, and heat is applied to melt the solder mixture, thereby securing and connecting the components to the board. Soldering is performed using heat up to 180 degrees Celsius.



In addition, Lenovo implemented a new system without increasing production costs by using existing materials as soldering alloys during the testing and verification process and by using existing oven equipment for heating.

Lenovo plans to apply a new low-temperature soldering process to eight SMT lines in 2017, and expects to reduce carbon emissions by up to 35% through this. In addition, they announced plans to build 33 SMT lines with two ovens per line using a new process by 2018, expecting to achieve an annual reduction of 5,956 tons of carbon dioxide.

In addition, they added that it is expected to improve product reliability by reducing the heat stress during the oven baking process.

Luis Hernandez, Vice President of the Integrated Development Center for PCs and Smart Devices at Lenovo, explained, “By applying a new low-temperature soldering process, Lenovo has once again demonstrated its commitment to maintaining a sustainable business across its entire PC business. Lenovo’s efforts toward innovation have extended beyond R&D and design into the manufacturing sector. Lenovo is striving to achieve its business goals while minimizing its environmental impact. We are very proud to have developed this new PC manufacturing process.”