마이크로칩 10월
This page was machine-translated and may differ from the original. View original

ST to Deliver Enhanced Sensor Performance with Third-Generation FlightSense Product

Preferred source on GooglePublished2017.02.23 13:42
Distance Measurement Sensor VL53L1 Accelerates Object Detection and Expands Measurement Range

STMicroelectronics has launched VL53L1, a third-generation laser distance measurement sensor based on industry FlightSense technology.

The sensor to be introduced leverages the benefits of patent-based silicon and module-level architecture, with optical lenses applied to the module. Through this combination, new features such as multi-target detection, signal interference prevention from cover glass at distance, and programmable multi-zone scanning have been added.



The sensor module form factor is 4.9 x 2.5 x 1.56mm, integrating a new lens system, 940nm VCSEL invisible light source, processing core, and SPAD photon detector into a single chip. With the addition of an optical lens system, the photon detection rate has increased, improving the distance measurement performance of the module. The embedded microcontroller controls the distance measurement function and drives digital algorithms, reducing the processing burden on the host and extending battery life during mobile application use.

VL53L1 performs measurements at a speed of 5ms in high-speed applications. Therefore, the autofocus application of a smartphone equipped with this sensor can detect subjects twice as fast as before. Additionally, the sensor's distance measurement range has been extended to over 4.5 meters and can also be utilized for hyperfocal distance of a 21-megapixel optical camera.

The distance measurement sensor VL53L1 can detect multiple targets on the screen, and developers can subdivide the SPAD sensing matrix into user-defined regions. The divided regions enable customer applications to provide spatial distance information that can be used not only for simple depth maps but also for dual-camera calculations in stereoscopy.

Eric Aussedat, head of STMicroelectronics' Imaging Business Unit, stated, "ST has already sold hundreds of millions of ToF sensors, with design adoption across various consumer devices through OEMs and over 70 smartphone models. This third-generation FlightSense product offers enhanced performance and can support new applications such as human detection while providing improved sensor performance in existing use cases."

Meanwhile, VL53L1 is scheduled to be exhibited at MWC being held in Barcelona, Spain from February 27 to March 2.
To request a correction, reply or follow-up report on this article, see how to file a request. Previously published statements are collected in corrections & replies.
서아람 Reporter

Comments