TI recently showcased reference designs incorporating the latest analog and embedded processing technologies at APEC, the largest power electronics industry event held in Tampa, Florida, USA.

The end-to-end high-frequency gallium nitride (GaN) power solution delivers 3 times higher power density compared to conventional solutions in space-constrained industrial, telecommunications, and networking applications.

The ultra-compact bidirectional DC/DC converter reference design provides 480W at 97% efficiency for local energy storage (LES) applications such as server power supplies and lithium battery backup power applications.

The ultra-low Iq, 24V AC power stage reference design optimizes smart thermostats, video doorbells, and gateway systems used in buildings by employing wide input voltage range converters and battery gauge ICs. This reference design employs a 65V maximum input voltage buck converter to enable HVAC systems to withstand transient conditions.

Additionally, TI showcased a PoE-capable LED lighting ballast demo for industrial LED lighting in smart buildings. This intelligently manages LED ballasts through Ethernet to provide lighting for industrial automation designs and reduces power consumption during standby.

TI provides reference designs focusing on USB Type-C applications and isolation technology reference designs based on ISOW7841 for protective relay and smart grid applications.