Rohm Expands SiC Power Module Product Lineup Accelerating High Efficiency and Miniaturization
Published2017.04.19 11:46Rohm has expanded its Full SiC power module lineup that contributes to high efficiency and miniaturization of high-power applications.
The Full SiC power modules were developed with 1200V 400A and 600A ratings for inverters and converters used in industrial power supplies, photovoltaic power conditioners, and UPS systems.
The company stated, "Through the development of a new package that optimizes our proprietary internal module structure and thermal design, we have realized the 600A rating." Additionally, compared to general IGBT modules with equivalent current ratings, switching loss is reduced by 64% (at chip temperature of 150℃), contributing to energy savings in applications.
Consequently, not only miniaturization of peripheral components due to high-frequency operation, but also miniaturization of cooling systems becomes possible as the effect of switching loss reduction during high-frequency operation becomes even greater. For example, when using SiC modules, based on calculation formulas derived from loss simulations in cooling systems, the liquid-cooled heatsink can be miniaturized by 88% compared to IGBT modules with equivalent current ratings.
Sample shipment and mass production of this module are scheduled to begin in June.
Related news
Rohm Develops Thermal Printer Driven by Single Cell Power Supply
Rohm has developed a new structure thermal print head KR2002-D06N10A series that operates with a single cell Li-ion battery power supply. A thermal print head is an electronic device that repeatedly generates and dissipates heat to print characters onto media such as thermal paper. Thermal print heads for payment terminals have conventionally been driven by a two-cell Li-ion battery power supply. This product improves heat retention by optimizing the glaze design of the heat retention layer and adopting a special low-resistance heating element.
2017.02.02by 김지혜 기자
ROHM Develops SoC Capable of Supporting All Audio Sources
Rohm has developed an audio SoC capable of playing not only existing media devices but also new media sound sources. The new product BM94803AEKU integrates the core functionality of audio applications into a single unit, enabling support for conventional media such as CD, USB, and SD as well as access via smartphones, Bluetooth, and USB-DAC. Additionally, the device supports various music file formats including FLAC and DSD.
2017.02.16by 서아람 기자
Lapis Semiconductor Develops Microcontroller Series for Home Appliances and Industrial Equipment
Rohm Group's Lapis Semiconductor has developed the ML62Q1000 series, a general-purpose microcontroller featuring a 16-bit CPU core for white goods appliances, small kitchen appliances, and industrial equipment currently in progress. Lapis Semiconductor states that the ML62Q1000 series comprises a total of 6 groups and 96 variants. It is a new series combining low power consumption technology and noise immunity technology, featuring both low power and ruggedness.
2017.02.21by 김지혜 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
