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Edge SW platform providing provisioning, connectivity, and processing capabilities
NXP Semiconductors announced that it will showcase its microprocessors (MPUs), microcontrollers (MCUs), and application processors for various IoT and security edge processing applications at AWS re:Invent 2017.
These products run on NXP Layerscape, i.MX application processors, and LPC MCU families. Secure edge processing not only reduces latency and bandwidth but also enhances the security of IoT solutions.
Currently commercial IoT requires both edge processing and security. Security provisioning, connectivity, and processing are required to support and operate edge processing devices connected to AWS. To this end, NXP has developed a powerful distributed cloud/edge software platform that provides all three of these capabilities.
"NXP offers a broad portfolio of MCU and MPU devices for building IoT solutions. By connecting this portfolio to AWS IoT services such as AWS GreenGrass, you can improve security and efficiency and build robust and flexible systems," said Tareq Bustami, Senior Vice President at NXP.
Demo products will be unveiled at the NXP booth (#200) and Digi International booth (#209) at Aria Quad, and at Builders Fair.
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