June 11, 2012, Seoul – Infineon Technologies (Korea Representative Director Seung-soo Lee) has launched the second-generation embedded power device family, ePower. This new TLE983x System-on-Chip (SoC) family meets the demands of space- and cost-sensitive automotive body applications by integrating a powerful 8-bit microcontroller, LIN transceivers, and related peripherals into a single chip. The new devices are designed for various types of LIN-slave motor control applications where a small package form factor and minimizing the number of external components are critical, such as window control, wipers, sunroofs, power seats, and fan/blower control. Additionally, these devices are suitable for space-constrained LIN-slave applications, such as keypad interfaces and switch panel interfaces.

Manufactured with Infineon's industry-first automotive-grade 130nm Smart Power technology, these new SoC devices have achieved a previously unseen level of integration. The small VQFN-48 package with a 7mm x 7mm footprint reduces the footprint by approximately 50 percent compared to previous generation devices. Compared to the previous generation TLE78xx multi-chip module devices, the new single-chip TLE983x devices provide improved CPU performance and flash memory capacity, a larger number of high-voltage monitoring inputs, and a smaller footprint, enabling cost reduction.

Andreas Doll, Executive Vice President and General Manager of Automotive Body Power at Infineon Technologies, said, “Infineon’s new second-generation ePower devices provide a system-on-chip semiconductor solution that integrates all the functions necessary to sense, control, and drive motors in space- and cost-sensitive automotive body applications. Automotive designers will be able to leverage enhanced design flexibility, save board space, simplify circuit complexity, lower power consumption, and reduce the bill of material (BOM).”

TLE983x: Motor control SoC integrating an 8-bit MCU, Flash, and relay driver
The TLE983x integrates all the features required for relay-driven motor control applications. Based on the existing XC800 product, the 8-bit microcontroller (MCU) achieves up to 10 Whetstone MIPS at 40 MHz, which is comparable to a 16-bit microcontroller. In addition, it integrates a LIN transceiver, voltage regulator, and low-side and high-side drivers onto a single chip. Other features include 4kB EEPROM emulation, an on-chip debug interface (2-wire), a 10-bit AD converter (5 channels), up to five high-voltage wake-up inputs, and a PWM unit for external motor control. Furthermore, it integrates a measurement interface for monitoring battery voltage and chip temperature. Low power mode allows for a sleep mode current of up to 25 μA, and starting in low power mode is possible via a LIN bus message or a wake-up input.

The LIN transceiver complies with LIN standards 2.0 and 2.1 and SAE J2602, making it suitable for global use. This high level of integration is based on new Automotive-grade (AEC) Smart Power technology, utilizing the industry's first 130nm process technology. The TLE983x family offers pin and software compatibility and provides devices with different flash memory sizes (36kB to 64kB).

supply
Engineering samples of the new TLE983x devices operate over a wide voltage range of 3.0V to 27V (up to 40V) and are supplied in VQFN-48 packages. This product family includes devices offering 36kB, 48kB, and 64kB of flash, as well as products integrating operational amplifiers and PN MOSFET drivers. For the TLE983x product family, Infineon and third-party vendors support a comprehensive development toolchain, including evaluation boards, IDEs, compilers, debuggers, and DAVE™ (Digital Application Virtual Engineer), Infineon's free development environment for automatic code generation.

Additional information
Further details on Infineon's ePower devices and automotive semiconductor product portfolio can be found at www.infineon.com/embeddedpower and www.infineon.com/automotive .