Designed with the latest smartphone display aspect ratio of 2.18:1
KAI-29050, KAI-29052, KAI-43140 PIN information sharing

On October 30, ON Semiconductor unveiled a 50-megapixel Charge-Coupled Device (CCD) that enables efficient smartphone display inspection.

With the launch of the KAI-50140, the highest resolution Interline Transfer CCD image sensor, it provides critical imaging details and high image uniformity required for smartphone display inspection, as well as circuit boards, machine assembly line inspection, and aerial surveillance.
The KAI-50140 is designed with a 2.18:1 aspect ratio that matches the latest smartphone screens, reducing the number of image captures required to inspect the entire display. The 4.5µm interline transfer CCD pixels used in the KAI-50140 provide high resolution with a true electronic (global) shutter while maintaining core imaging performance. It supports frame rates of up to 4fps using a variable data output structure of 1, 2, or 4.

In addition, it shares the same pin information (Pin definition) with the 29-megapixel KAI-29050 and KAI-29052 and the 43-megapixel KAI-43140 image sensors. This allows the KAI-50140 to be integrated into existing camera designs with only minor electrical changes, shortening the time-to-market for new device adoption.

Herb Erhardt, Vice President and General Manager of the Industrial Solutions Business Unit at ON Semiconductor’s Intelligent Sensing Group, said, “As smartphone display specifications and aspect ratios continue to expand not only in physical size but also in pixel density, we had to develop an image sensor specifically designed for device inspection. The combination of high resolution, image uniformity, and a 2.18:1 pixel array provided by the KAI-50140 enhances the quality of the latest smartphone displays and enables more efficient inspection.”

The KAI-50140, currently available as a sample, is scheduled for production in late 2018 and will be available in ceramic PGA packages in monochrome and RGB Bayer color configurations. A demonstration of the new product will be held at the ON Semiconductor booth (1B32) at the VISION 2018 trade fair, which will be held in Stuttgart, Germany, from November 6 to 8.