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Integrated with 3M digitally enabled smart code signing technology
Promoting the advancement of connected and autonomous vehicle technologies 
ON Semiconductor and 3M have agreed to cooperate in the field of autonomous driving.
On Semiconductor announced on the 8th that it has entered into a partnership with 3M to improve communication between vehicles and road infrastructure.
The two companies plan to enhance the navigation capabilities of autonomous vehicles by integrating image detection technology and decades of experience in the field of road safety.
During CES 2019, ON Semiconductor showcased its AR0234AT CMOS image sensor integrated with 3M's next-generation digitally enabled smart code signing technology at the ON Semiconductor demo room set up at the Venetian Hotel.
This collaboration is expected to accelerate the development of next-generation infrastructure solutions and promote the advancement of connected and automated vehicle technologies.
This announcement is based on 3M’s 80 years of effort to improve traffic safety and ON Semiconductor’s efforts to provide advanced sensing technologies and solutions to automotive manufacturers and suppliers.
Ross Jatou, Vice President and General Manager of ON Semiconductor’s Automotive Solutions business unit, stated, “Our image sensors are the eyes of autonomous vehicles, and sensor technology enables the vehicle to see more than the driver,” adding, “toward our sensors and 3M’s advanced materials technology"By providing additional information from advanced infrastructure, we have been able to enhance driver assistance to a level that surpasses existing ADAS and pave the way for autonomous driving," he said.
Daniel Chen, Vice President and General Manager of 3M’s Traffic Safety business unit, said, “To achieve fully autonomous driving, an integrated system is needed that allows vehicles to communicate with other vehicles and the driving ecosystem,” adding, “The two companies will take the first step in building an integrated system that can make connected and autonomous vehicles safer and more efficient.”
Promoting the advancement of connected and autonomous vehicle technologies

ON Semiconductor and 3M have agreed to cooperate in the field of autonomous driving.
On Semiconductor announced on the 8th that it has entered into a partnership with 3M to improve communication between vehicles and road infrastructure.
The two companies plan to enhance the navigation capabilities of autonomous vehicles by integrating image detection technology and decades of experience in the field of road safety.
During CES 2019, ON Semiconductor showcased its AR0234AT CMOS image sensor integrated with 3M's next-generation digitally enabled smart code signing technology at the ON Semiconductor demo room set up at the Venetian Hotel.
This collaboration is expected to accelerate the development of next-generation infrastructure solutions and promote the advancement of connected and automated vehicle technologies.
This announcement is based on 3M’s 80 years of effort to improve traffic safety and ON Semiconductor’s efforts to provide advanced sensing technologies and solutions to automotive manufacturers and suppliers.
Ross Jatou, Vice President and General Manager of ON Semiconductor’s Automotive Solutions business unit, stated, “Our image sensors are the eyes of autonomous vehicles, and sensor technology enables the vehicle to see more than the driver,” adding, “toward our sensors and 3M’s advanced materials technology"By providing additional information from advanced infrastructure, we have been able to enhance driver assistance to a level that surpasses existing ADAS and pave the way for autonomous driving," he said.
Daniel Chen, Vice President and General Manager of 3M’s Traffic Safety business unit, said, “To achieve fully autonomous driving, an integrated system is needed that allows vehicles to communicate with other vehicles and the driving ecosystem,” adding, “The two companies will take the first step in building an integrated system that can make connected and autonomous vehicles safer and more efficient.”
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