Air Liquide Chairman Park Il-yong receives Gold Tower Industrial Medal
Air Liquide East Asia Pacific Chairman Park Il-yong received the Gold Tower Industrial Medal in recognition of leading approximately 5 trillion won in…
2026.11.05 by 배종인 기자
Chairman Lee Jae-yong Inspects Advanced Packaging…Visits Yokohama APL in Japan
Samsung Electronics Chairman Lee Jae-yong visited the 'Advanced Package Lab (APL)', an advanced semiconductor packaging research hub in Yokohama, Japa…
2026.11.02 by 배종인 기자
Keysight, "Evolving into an Engineering Platform Company Opening the AI Era"
Keysight Technologies held Keysight World Tech Day Seoul 2026 and shared core technologies and design and validation strategies in AI semiconductors, …
2026.10.21 by 배종인 기자
ASML records record-breaking Q3 results... "ASML production capacity determines the ceiling for advanced semiconductor supply"
ASML's Q3 2026 results demonstrate that the semiconductor industry is entering a new phase. The company achieved record-breaking results with revenue …
2026.10.16 by 배종인 기자
Panasia Accelerates CXL Appliance Deployment at OCP Global Summit 2026
Panasia unveiled a complete CXL server rack solution based on PCIe 6.4-CXL 3.2 fusion switch technology at OCP Global Summit 2026. As memory demand in…
2026.10.15 by 배종인 기자
SK Hynix Unveils Next-Generation Memory Hierarchy Optimization Strategy at SEDEX 2026
SK Hynix diagnosed new memory bottleneck issues arising from the expansion of the AI inference market at SEDEX 2026 and disclosed resolution strategie…
2026.10.14 by 배종인 기자
Applied Materials Unveils $5 Billion EPIC Center in Silicon Valley
Applied Materials has opened a $5 billion EPIC (Equipment, Process Innovation, and Commercialization) center in Silicon Valley. Major semiconductor ma…
2026.10.13 by 배종인 기자
Henkel to Unveil Advanced Packaging Materials for AI and HBM at SEDEX 2026
Henkel will showcase semiconductor high-density packaging solutions for the AI and HBM era at SEDEX 2026. Through advanced materials such as underfill…
2026.10.06 by 배종인 기자
[e4ds Tech Day 2026 ⑥] Dong-Joo Shin, Mobilint CEO, "Winner of Physical AI Era is AI SoC, Not GPU"
At the keynote speech of 'e4ds Tech Day 2026', Dong-Joo Shin, CEO of Mobilint, stated that AI computation is shifting from GPU-centric to AI SoC and N…
2026.10.02 by 배종인 기자
Applied Materials and KIOXIA to Co-develop Next-Generation Memory at EPIC Center
Applied Materials and KIOXIA are undertaking joint development of next-generation memory for AI at the EPIC Center in Silicon Valley. The two companie…
2026.09.30 by 배종인 기자
LG Chem Expands Semiconductor Cleaning Materials Business…Collaborates with China's Jianghua Wei on Ultra-high Purity IPA
LG Chem is moving to expand its ultra-high purity IPA (isopropyl alcohol) business, a core material for semiconductor processes. The company is buildi…
2026.09.14 by 배종인 기자
Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar…
2026.08.31 by 배종인 기자
Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM…
2026.08.28 by 배종인 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and effici…
2026.08.28 by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West…
2026.08.28 by 배종인 기자