“Kulicke & Soffa (hereinafter referred to as K&S) is contributing to improving the efficiency and quality of advanced semiconductor manufacturing processes such as AI semiconductors and HBM through various cutting-edge technologies that remove oxides and enable high-quality bonding in semiconductor packaging processes in the AI era, and through this, we will actively seek to expand our market in the Korean market as well.”

Global semiconductor equipment company Kulicke & Soffa (K&S) held a press conference at Signiel in Jamsil on the 18th and announced that it would actively advance into the Korean market by leading the way with its advanced semiconductor packaging technology.

At the press conference, Chan Pin Chong, Executive Vice President (EVP) of K&S, said, “K&S will provide the best technology to customers through innovative packaging technology and products,” and “We will continue to lead the innovation of next-generation semiconductor manufacturing processes through continuous research and development, actively respond to the domestic semiconductor market, and contribute to the development of the market.”

K&S has been leading the way for the past 10 years We have focused on developing packaging technology and have led important changes in the semiconductor industry.

Vertical Fan-Out Wafer Level Packaging (VFO WLP) technology sets a new standard for semiconductor packaging by reducing wafer packaging thickness by 27% and improving power efficiency by 5%.

K&S is leading Wafer Level Packaging (WLP) and Fluxless Bonding technology through cutting-edge packaging equipment including ATPremier MEM PLUS, the representative equipment for Wafer Level Bonding (WLB).

In particular, K&S's Thermo-Compression Bonding (TCB) solution is rapidly expanding its market share in the data acceleration processing units (APUs), central processing units (CPUs), silicon photonics (SiPh) that processes data using light, and vertical-cavity surface-emitting laser (VCSEL) markets.

In addition, it is characterized by being able to stably produce fine pitch and large die (a square structure made of semiconductor material) through fluxless bonding.

In addition, packaging quality was further improved by applying formic acid-based oxide removal technology.

To meet the demands of the data center and high-performance computing (HPC) markets, customers are actively adopting next-generation Co-Packaged Optics (CPO) technology.

To support this, K&S is developing 2.5D/3D packagingIt provides an advanced TCB technology.

Additionally, K&S' packaging solutions help reduce power consumption by 30% compared to existing solutions, improve rack density and integration time by 50%, and realize 40% lower optical cost per bit, enabling more economical data center construction.

K&S continues to unveil innovative solutions for the semiconductor equipment industry and is developing equipment that integrates process optimization and inspection functions by introducing the smart factory concept.

In particular, Advanced Optical System Inspection (AOI) technology provides inspection capabilities within the equipment, contributing to increased yield, and the single-machine solution can flexibly process 8-inch and 12-inch wafers, meeting diverse customer needs.

K&S has moved away from traditional wire bonding methods and introduced a wafer-level-based solution, breaking away from existing substrate-based solutions and reducing package thickness by 27% and improving signal transmission.

Smart Response Base Process is a technology that automatically generates recipes by optimizing data on the equipment itself, maximizing process efficiency.

Vertical wire technology is also noteworthy.

K&S’s technological innovation is also attracting attention in the Korean market. Major semiconductor manufacturers are implementing high-performance semiconductor packaging by introducing fluxless bonding technology and producing high-performance semiconductor products using kappa-to-kappa bonding technology.