Infineon Technologies (Korea CEO Seung-Soo Lee) is making a key contribution to energy savings in data centers by launching power modules with best-in-class power density.

Infineon has launched the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers.

This module supports true vertical power delivery (VPD) and delivers an industry-leading current density of 1.6 A/mm2.

The TDM2354xD and TDM2354xT modules combine Infineon’s robust OptiMOS™ 6 trench technology, a chip-embedded package that delivers superior power density with improved electrical and thermal efficiency, and a new inductor technology that enables lower profile and true vertical power delivery.

As a result, it sets new standards for power density and quality, maximizing computing performance and efficiency in AI data centers.

The TDM2354xT module supports up to 160 A and is the industry's first 8x8㎟ small form factor trans-inductor voltage regulator (TLVR) module.

When combined with Infineon’s XDP™ controller, it provides very fast transient response and minimizes onboard output capacitance by up to 50 percent, enabling further increased system power density.

Infineon OptiMOS Samples of the dual-phase power modules TDM2354xD and TDM2354xT are now available.

Meanwhile, data centers currently consume more than 2 percent of global energy supply. With advances in AI, that number is expected to increase to as much as 7 percent by 2030, which is equivalent to India’s current energy consumption. Enabling efficient power conversion from grid to core is essential to achieving superior power density, improving compute performance, and reducing total cost of ownership (TCO).