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Samsung Electronics Successfully Develops Next-Generation RFIC and DAFE Chips for 5G Base Stations
Samsung's 5G RFIC maintains low power while improving performance.
Samsung DAFE reduces base station power consumption by approximately 25%.
Accelerating the miniaturization and lightweighting of base stations will increase 5G deployment.
Samsung Electronics has successfully developed a wireless communication core chip (RFIC) for next-generation 5G mmWave base stations that significantly enhances wireless communication performance. 
Samsung Electronics' next-generation 5G RFIC chipset
The next-generation wireless communication core chip significantly improves supported frequencies and communication performance, while still maintaining industry-leading low-power performance. In 2017, Samsung Electronics developed a first-generation wireless communication core chip with industry-leading low-power performance.
The next-generation wireless communication core chip has expanded the signal bandwidth by 75% from the existing 800㎒ to 1.4㎓, and has improved noise and linearity characteristics to enhance transmission and reception sensitivity, thereby expanding the maximum data transmission rate and service coverage.
The size has also been reduced by approximately 36% compared to the previous model, and the low-power function and minimization of heat dissipation structures can further miniaturize 5G base stations.
This next-generation wireless communication core chip can support 28 GHz and 39 GHz, which will further enhance the competitiveness of 5G products in countries such as the US and Korea, which have selected this band as the 5G commercial frequency band.
Samsung Electronics plans to mass-produce next-generation wireless communication core chips starting in the second quarter of this year, and will additionally develop chips for the 24 GHz and 47 GHz frequencies, which are scheduled for additional allocation in Europe and the United States, within the year. 
Samsung Electronics' 5G DAFE chip
Samsung Electronics also succeeded in developing its own digital-to-analog conversion chip (DAFE).
The digital-to-analog conversion chip is a chip that converts digital and analog signals for 5G ultra-wide bandwidth communications. When applied to 5G base stations, it can reduce the size, weight, and power consumption of the product by approximately 25%.
The miniaturization and lightweighting of base stations will reduce network investment and operating costs for telecommunications carriers, enabling them to provide 5G services more quickly in more areas.
samsung“Samsung Electronics is leading the commercialization of 5G in Korea and the United States, and has supplied more than 36,000 5G base stations to key domestic and foreign operators to date,” said Jeon Kyung-hoon, Executive Vice President and Head of the Electronics Network Business Division. “As a leader in the 5G market, we will accelerate the spread of ultra-high-speed, ultra-low-latency, and hyper-connected infrastructure through continuous differentiation of 5G technology, and open the era of the Fourth Industrial Revolution, bringing about new changes to individuals’ lives and industries.”
Samsung DAFE reduces base station power consumption by approximately 25%.
Accelerating the miniaturization and lightweighting of base stations will increase 5G deployment.
Samsung Electronics has successfully developed a wireless communication core chip (RFIC) for next-generation 5G mmWave base stations that significantly enhances wireless communication performance.

Samsung Electronics' next-generation 5G RFIC chipset
The next-generation wireless communication core chip significantly improves supported frequencies and communication performance, while still maintaining industry-leading low-power performance. In 2017, Samsung Electronics developed a first-generation wireless communication core chip with industry-leading low-power performance.
The next-generation wireless communication core chip has expanded the signal bandwidth by 75% from the existing 800㎒ to 1.4㎓, and has improved noise and linearity characteristics to enhance transmission and reception sensitivity, thereby expanding the maximum data transmission rate and service coverage.
The size has also been reduced by approximately 36% compared to the previous model, and the low-power function and minimization of heat dissipation structures can further miniaturize 5G base stations.
This next-generation wireless communication core chip can support 28 GHz and 39 GHz, which will further enhance the competitiveness of 5G products in countries such as the US and Korea, which have selected this band as the 5G commercial frequency band.
Samsung Electronics plans to mass-produce next-generation wireless communication core chips starting in the second quarter of this year, and will additionally develop chips for the 24 GHz and 47 GHz frequencies, which are scheduled for additional allocation in Europe and the United States, within the year.

Samsung Electronics' 5G DAFE chip
Samsung Electronics also succeeded in developing its own digital-to-analog conversion chip (DAFE).
The digital-to-analog conversion chip is a chip that converts digital and analog signals for 5G ultra-wide bandwidth communications. When applied to 5G base stations, it can reduce the size, weight, and power consumption of the product by approximately 25%.
The miniaturization and lightweighting of base stations will reduce network investment and operating costs for telecommunications carriers, enabling them to provide 5G services more quickly in more areas.
samsung“Samsung Electronics is leading the commercialization of 5G in Korea and the United States, and has supplied more than 36,000 5G base stations to key domestic and foreign operators to date,” said Jeon Kyung-hoon, Executive Vice President and Head of the Electronics Network Business Division. “As a leader in the 5G market, we will accelerate the spread of ultra-high-speed, ultra-low-latency, and hyper-connected infrastructure through continuous differentiation of 5G technology, and open the era of the Fourth Industrial Revolution, bringing about new changes to individuals’ lives and industries.”
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