Byco Hosts High-Performance Power Conversion Seminar
Based on advanced topology and packaging technologies
Power density increases by 25% every two years, while losses decrease by 25%.


Data is often referred to as the resource of the Fourth Industrial Revolution. However, utilizing this data requires something else: electricity.

As the amount of data to be processed increases, so does the power consumption. To address this, building a high-performance power system is necessary.

On the 18th, Byco held a press conference titled “Power Electronics at the Crossroads” at the L Tower in Yangjae-dong, Seoul, and announced its business strategy and vision.

This meeting is part of a series of high-performance power conversion seminars and workshops being held by Bycor in 12 cities across 8 countries, and was attended by Jeong Gi-cheon, CEO of Bycor Korea, Eric Wong, Vice President of Sales and Marketing for Asia, and Chris R. Swartz) was in attendance as Chief Engineer.

CEO Jeong Gi-cheon introduced Bycor as a company specializing in the conversion and regulation of power distribution networks (PDNs), manufacturing high-performance, high-density power modules, and having strengths in power distribution architecture, conversion topology, and packaging technology.

Focusing on the defense, communications, computing, industrial, and automotive markets, Vicor offers a diverse portfolio of modular power solutions, from front-end to point-of-load, enabling customers to easily build PDNs.

Topologies such as the Zero-Voltage Switching (ZVS) regulator, the 'double-clamp ZVS (DC-ZVS)' isolated DC-DC and AC-DC converter, and the 'sine amplitude converter (SAC)' isolated fixed-ratio DC-DC transformer were also introduced.

There are three packaging technologies used: 'VIA (Vicor Integrated Adapter)', which integrates adapters; 'ChiP (Converter Housed in Package)', which houses converters in packages; and 'SiP (System in Package)', which mounts and molds components on a substrate.

By leveraging these topologies and packaging technologies, Vicor aims to continuously release products that improve power density by 25% and reduce power loss by 25% every two years.

CEO Jeong Gi-cheon said, “There will come a time when power density that is three to four times higher than what it is now will be required,” and “Bycor will be supplying power trains, control systems, components, and packaging.” “We hold over 170 patents related to technology and reinvest 16% of our sales into R&D,” he said.

Meanwhile, “Bycor is currently reviewing power semiconductor businesses based on silicon carbide (SiC) and gallium nitride (GaN), which have higher power conversion efficiency than silicon (Si) and can operate at high voltages,” he said, adding, “We are developing vertical power delivery technology that places processors and power modules above and below the PCB to shorten the distance and increase power efficiency.”

Meanwhile, at the '2019 High-Performance Power Conversion Seminar and Workshop' held by Bycor after the press conference, Professor Ho-Young Cha, head of the Next Generation Semiconductor Lab at Hongik University, and Manager Woo-Jin Kang and Deputy Manager Hoe-Gwang Choi of Bycor Korea shared insights on power solutions with approximately 140 engineers.