WD Unveils Embedded UFS 3.1 for 5G Smartphones
Published2020.02.21 11:03Includes UFS 3.1 Booster for 5G Smartphones
On the 21st, Western Digital unveiled the 'iNAND MC EU521', an embedded UFS (Universal Flash Storage) device based on 96-layer 3D NAND.
EU521 is optimized for 5G applications and performance by applying Write Booster technology from the next-generation industry standard UFS 3.1, newly announced by JEDEC.
EU521 enables mobile developers to fully utilize the advantages of the high bandwidth (Gear 4/2 lanes) of the UFS 3.1 interface and SLC (single-level cell) NAND caching.
In addition, it provides sequential write speeds of up to 800MB/s, improving the user experience for applications such as downloading 4K and 8K content, transferring large files from the cloud, and gaming.
Western Digital's iNAND MC EU521 is scheduled to be released this coming March in two capacities: 128GB and 256GB.
관련뉴스
WD Launches 6 New SanDisk Mobile Storage Models
As an era has arrived where anyone can produce high-quality 4K content and similar materials, the demand for fast and secure storage of large-capacity data is growing. Western Digital announced six types of SanDisk mobile storage solutions catering to both professional and general users on the 30th. New product lines including the SanDisk Extreme Pro CF Express Card Type B and SanDisk Ultra USB Type-C Flash Drive were unveiled on this occasion.
2020.01.30by 이수민 기자
Samsung Electronics' growth engines for 2020 are 5G chips and high-resolution sensors
Samsung Electronics announced its fourth-quarter 2019 results on the 30th, reporting consolidated revenue of 59.88 trillion won and operating profit of 7.16 trillion won. First quarter 2020 is expected to see a decline in results due to seasonal off-season effects. Nevertheless, Samsung Electronics anticipates that major business divisions will grow in 2020.
2020.01.31by 이수민 기자
Samsung Electronics Targets HPC Market with 16GB HBM2E Memory
삼성전자가 HPC와 AI 기반 초고속 데이터 분석에 활용될 수 있는 고속 D램, 플래시볼트를 출시했다. 플래시볼트는 1개의 버퍼 칩 위에 16기가비트 10나노급 D램 칩 8개를 쌓아 16GB의 용량을 구현했다.
2020.02.04by 이수민 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
