TPSM53604 buck module, compared to competing 3.5A modules
Reduces device size by 30% and power loss by 50%


Texas Instruments (TI) announced on the 25th the release of the TPSM53604 DC/DC buck module.

The TPSM53604 is a power module with a 5mm × 5.5mm footprint that adopts a QFN package, reducing power supply size by up to 30% and power loss by up to 50% compared to competing 3.5A modules.

A single thermal pad maximizes heat transfer, simplifying board mounting and layout. Capable of operating at ambient temperatures up to 105°C, it is ideal for applications such as factory automation and control, power grid infrastructure, test and measurement, industrial transportation, and aerospace and defense.

The TPSM53604 meets CISPR 11 Class B EMI requirements by integrating high-frequency bypass capacitors and eliminating bond wires. Additionally, combining the TPSM53604 with a step-down module such as the TPSM82813 or TPSM82810 allows design of a power solution that ranges from a 24 V input to the point of load.

It is currently available through TI and authorized distributors, with pricing starting at $3.65 per unit in 1,000-unit quantities. The TPSM53604 evaluation module is also available for $49. The TPSM53602 (2A) and TPSM53603 (3A) modules are also available now, priced at $2.64 and $3.21, respectively, in 1,000-unit quantities.