Nordic nRF52805 Bluetooth 5.2 SoC
Optimized for 2-layer PCB design


On the 22nd, Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 SoC, the seventh product in the nRF52 series.

The nRF52805, a Bluetooth LE SoC, is available in a 2.48×2.46mm WLCSP (Wafer Level Chip Scale Package) package with 10 GPIOs. Optimized for 2-layer PCB designs, it eliminates the need for expensive 4-layer PCBs, making it suitable as a Bluetooth LE solution for mass-produced small wireless applications.

It supports transmission speeds up to Bluetooth LE 2Mbps and can improve coexistence with enhanced channel selection algorithm #2 (CSA #2).

The nRF52805 has a 64MHz 32-bit Arm® Cortex®-M4 processor and supports 192KB of flash and 24KB of RAM. Multi-protocol (Bluetooth LE/2.4GHz) wireless provides a maximum output power of +4dBm and a reception sensitivity of -97dBm (1Mbps Bluetooth LE) at a link budget of 101dBm.

The maximum power consumption is 4.6mA (TX 0dBM, RX 1Mbps), and the current consumption is 0.3µA when the system is off and 1.1µA when the system is on, with 24KB RAM stored and RTC running. It is driven by a supply voltage of 1.7–3.6V and includes an LDO and a DC/DC voltage regulator.

In addition, it features various analog and digital interfaces such as SPI, UART, and TWI, as well as a 2-channel 12-bit ADC and 10 GPIOs. Nordic provides a 9.5×8.8mm reference design that utilizes all 10 GPIOs, requiring only 10 external passive components (including two crystal load capacitors).

The nRF52805 is currently supported by S112 SoftDevice (Bluetooth 5.1 certification protocol software), and S113 SoftDevice support is scheduled to be added soon. S112 and S113 SoftDevice are stacks for memory-optimized peripherals that support a transmission speed of 2 Mbps and CSA #2 functionality.

This stack supports up to four connections to function as both a broadcaster and a peripheral, and the number of connections and bandwidth per connection can be configured to optimize memory and performance.

S112 and S113 support LE secure connections that can improve security performance compared to LE legacy pairing. In particular, S113 supports LE Data Packet Length Extension, thereby enabling faster transmission speeds and reducing overhead per packet.

Guides on the use of the nRF5 SDK (Software Development Kit) and the nRF52805 are also provided. The nRF52 DK (Development Kit) can be used for evaluating the nRF52805, providing a hardware foundation to begin designing before moving on to a custom development board.

nRF52805 is currently in mass production.