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Infineon 3D Magnetic Sensor Saves Board Space with Low Height

Google 우선 소스Published2020.07.29 11:32
Infineon TLI493D-W2BW 3D Magnetic Sensor
WLB-5 package, standby current consumption 7nA
Its low height allows additional components to be mounted on top of the sensor.



On the 29th, Infineon Technologies launched the XENSIV 3D magnetic sensor, which has a lower height compared to existing products.
▲ TLI493D-W2BW 3D Magnetic Sensor [Photo = Infineon]

Featuring Infineon's latest 3D Hall technology, the TLI493D-W2BW offers new design options with an 87% smaller footprint and 46% lower height compared to existing magnetic sensors.

The TLI493D-W2BW, available in an ultra-small WLB-5 package (1.13mm × 0.93mm × 0.59mm), has a current dissipation of 7nA in standby mode and is suitable for applications that previously used resistance-based or optical solutions.

Its low profile makes it useful for applications with very limited space, such as BLDC commutators for micro motors or controllers for joysticks and game consoles. It is also possible to design it as a double-sided PCB or mount the sensor between two PCBs. Additional components can also be mounted on top of the sensor.

It offers four product versions with integrated wake-up functions and pre-configured standard addresses. It supports higher resolution (typ. 32.5–130 µT/LSB12) compared to previous generation products, expanding the range of applicable applications. It also supports XY angle measurement.

The update rate is up to 5.7 kHz (8.4 kHz for XY), and in low-power mode, the resolution can be adjusted in 8 steps from 0.05 Hz to 770 Hz. Power consumption in standby mode is 7 nA, and the power current is 3.4 mA. An I2C interface and a dedicated interrupt pin are also included.

Infineon is currently supplying samples of the TLI493D-W2BW and plans to begin mass production this coming August.
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