Microchip Adopts JEDEC Plastic Package
Unveiled High-Reliability Radiation-Resistant RTG4 FPGA with Lower Cost


Developers of small satellites and other systems used in space must provide high reliability and radiation resistance while simultaneously meeting stringent cost and schedule requirements. Accordingly, Microchip Technology launched its first radiation-resistant (RT) FPGA on the 30th. It is offered at an affordable price by adopting a JEDEC-certified plastic package, and thanks to the proven reliability of the RTG4™ FPGA, it does not require going through the full Qualified Manufacturers List (QML) certification process.

The Microchip RTG4 sub-QML FPGA is a flip-chip 1657-ball grid array plastic package with a ball pitch of 1.0 mm and has obtained JEDEC certification. It is pin-compatible with Microchip's QML Class V certified RTG4 FPGA available in a ceramic package, allowing developers to easily migrate designs between strict Class 1 missions. In addition, the RTG4 sub-QML FPGA, available in a plastic package, is also available as a small-batch prototype, allowing for the evaluation of products and the prototyping of systems prior to mass production of flight models.

Other Microchip products available in plastic packages for spaceflight systems include the LX7730 telemetry controller, the LX7720 position sensing and motor controller, and microcontrollers, microprocessors, Ethernet PHYs, analog-to-digital converters (ADCs), flash, and EEPROM available in high-reliability plastic versions. The JEDEC-certified RTG4 sub-QML FPGA, available in a 1657-ball plastic BGA package, is currently in mass production.