Microchip Launches Aerospace-Qualified Baseless Power Module
Published2021.08.04 10:30For AC-DC and DC-AC power conversion
Compliant with RTCA DO-160G G version guidelines
Aircraft pneumatic and hydraulic systems are being replaced with electric systems to reduce carbon emissions. New power conversion technologies are needed to implement next-generation aircraft electrical systems. Microchip Technology, in collaboration with the European Commission (EC) and industry consortium Clean Sky, today announced the launch of aerospace-certified baseless power modules that support high-efficiency, lightweight, and compact power conversion and motor drive systems.
[Photo = Microchip]
Microchip's BL1, BL2, and BL3 baseless power module families, in collaboration with Clean Sky, support the aerospace industry's goals, based on stringent emissions standards, for climate-neutral aviation by 2050. They integrate SiC power semiconductor technology to enhance the efficiency of AC-DC and DC-AC power conversion and generation.
Using a modified substrate, the new power modules are 40% lighter than comparable products and offer approximately 10% cost savings compared to standard power modules using metal base plates. Microchip BL1, BL2, and BL3 devices comply with all mechanical and environmental guidelines specified in RTCA DO-160G, "Environmental Conditions and Test Procedures for Airborne Equipment," Version G (August 2010). RTCA is an industry consortium that works to reach agreements on aviation modernization issues.
Developers can accelerate development and enhance reliability by purchasing low-profile, low-inductance packaging with power and signal connectors that can be soldered directly to the printed circuit board. Furthermore, the module height within the family is consistent, enabling the implementation of high-performance power converters and inverters in parallel or in combination in three-phase bridge and other topologies.
Integrated SiC MOSFETs and Schottky barrier diodes (SBDs) enhance system efficiency. The BL1, BL2, and BL3 product families are available in packages that deliver power from 100 W to over 10 kW and offer a variety of topology options, including phase-leg, full bridge, asymmetric bridge, boost, buck, and dual common-source. These power modules are available with SiC MOSFETs rated at 600 V to 1200 V and 75 A to 145 A, and IGBTs for rectifier diodes rated at 600 V to 1600 V and 50 A to 90 A.
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