ACM Research, Inc., a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, is expanding its wet cleaning portfolio with new equipment for advanced semiconductor wafer fabrication, including advanced logic, DRAM, and 3D NAND.

ACM Research announced on the 30th that it has recently launched its first 300mm single wafer Sulfuric Peroxide Mixture system (SPM) equipment.

This equipment can be widely used in wet cleaning and etching processes for manufacturing advanced logic, DRAM, 3D-NAND chips, and other integrated circuits (ICs), and is particularly suitable for photoresist (PR) removal processes utilizing high-capacity ions and metal etching and strip processes.

This product is an extension of ACM Research's existing SPM process product, and supports more diverse and detailed temperature steps by adding a high-temperature step in an advanced process of 10 nm or less.

David Wang, CEO of ACM Research, commented on the launch of this device, “This single SPM device is based on our Ultra C Tahoe device, which has received favorable reviews from our customers. The existing Ultra C Tahoe system supports most SPM process steps at normal temperatures, and this new system adds high-temperature SPM process capability, expanding ACM's portfolio in wet cleaning equipment. The Tahoe and single-SPM systems support virtually all SPM processes currently deployed in advanced semiconductor manufacturing. ACM aims to become a leading global cleaning solutions provider, continuing to develop new process capabilities, including advanced high-temperature isopropyl alcohol (IPA) drying and supercritical carbon dioxide drying technologies.